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Plasma Damage

  • Francis F. Chen
  • Jane P. Chang

Abstract

The exposure of wafers to a plasma causes a variety of “damage” to the thin films beneath, as summarized in Table 1 and 2 at the end of this section. The nature of these damage mechanisms is varied but are all considered faulty during electrical testing.

Keywords

Deposition Flux Gate Oxide Plasma Potential Mechanical Abrasion Electrical Stress 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science+Business Media New York 2003

Authors and Affiliations

  • Francis F. Chen
    • 1
  • Jane P. Chang
    • 2
  1. 1.Electrical Engineering DepartmentUniversity of CaliforniaLos AngelesUSA
  2. 2.Chemical Engineering DepartmentUniversity of CaliforniaLos AngelesUSA

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