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Applications in Microelectronics

  • Francis F. Chen
  • Jane P. Chang

Abstract

Plasmas are used in several major microelectronics processes: sputtering, plasmaenhanced chemical vapor deposition (PECVD), plasma etching, ashing, implantation, and surface cleaning/modification, each is described below and a few process steps are shown schematically in Fig. 3:
  • Deposition:
    • - Semiconductor (silicon)

    • - Metal (aluminum, copper, alloys)

    • - Dielectric (silicon dioxide, silicon nitride, metal oxides, low-k dielectrics)

  • Etching:
    • - Semiconductor (silicon)

    • - Metal (aluminum, copper, alloys)

    • - Dielectric (silicon dioxide, silicon nitride, metal oxides, low-k dielectrics)

  • Ashing:
    • - Photoresist removal

    • - Photoresist trimming

  • Implantation:
    • - Dopant ion implant (B+, P+, As+ ...etc.)

Keywords

Silicon Nitride Reactive Neutral Etching Product Plasma Etching Process Target Electrode 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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References

  1. 1.
    F.F. Chen, Electric Probes, in “Plasma Diagnostic Techniques”, ed. by R.H. Huddlestone and S.L. Leonard (Academic Press, New York, 1965), Chap. 4, pp. 113-200.Google Scholar
  2. 2.
    F.F. Chen, Phys. Plasmas 8, 3029 (2001).ADSCrossRefGoogle Scholar
  3. 3.
    F.F. Chen, J.D. Evans, and D. Arnush, Phys. Plasmas 9, 1449 (2002)ADSCrossRefGoogle Scholar
  4. 4.
    I.D. Sudit and F.F. Chen, RF compensated probes for high-density discharges, Plasma Sources Sci. Technol. 3, 162(1994).ADSCrossRefGoogle Scholar
  5. 5.
    N. Hershkowitz, How Langmuir Probes Work, in Plasma Diagnostics, Vol. 1, Ed. by O. Auciello and D.L. Flamm (Acad. Press, N.Y., 1994), Chap. 3, p. 113.Google Scholar

Copyright information

© Springer Science+Business Media New York 2003

Authors and Affiliations

  • Francis F. Chen
    • 1
  • Jane P. Chang
    • 2
  1. 1.Electrical Engineering DepartmentUniversity of CaliforniaLos AngelesUSA
  2. 2.Chemical Engineering DepartmentUniversity of CaliforniaLos AngelesUSA

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