Abstract
In electronics manufacturing, an electric interconnection or a system integration step is always required before releasing products. All expected PE products introduced in Chap. 1 require certain kinds of system integration. For instance, displays fabricated using PE technology always require several logic circuits, an energy supply, wireless/wired connection circuits, and other features. Photovoltaic cells require series interconnections and connectors to cables to a battery or a power conditioner. Thus, an interconnection method is one of the essential technologies for PE products. Several important requirements for PE interconnection technology are listed as follows:
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
References
Suganuma K (2001) Advances in lead-free electronics soldering. Curr Opin Solid State Mater Sci 5(1):55–64
Suganuma K, Sakai T, Kim K-S, Takagi Y, Sugimoto J, Ueshima M (2002) Thermal and mechanical stability of soldering QFP with Sn-Bi-Ag lead-free alloy. IEEE Trans Electron Packag Manuf 25(4):257–261
Suh D, Hwang C-W, Ueshima M, Sugimoto J (2008) A novel low-temperature solder, based on intermetallic-compound phases: alloy design, high-homologous temperature properties, and reliability. JOM 62(12–13):71–76
Inoue M, Kawahito Y, Tada Y, Hondo T, Kawasaki T, Suganuma K, Ishiguro H (2008) A super-flexible sensor system for humanoid robots and related applications. J Jpn Inst Electron Packag 11(2):136–140
Wakuda D, Suganuma K (2011) Stretchable fine fiber with high conductivity fabricated by injection forming. Appl Phys Lett 98:073304
Araki T, Nogi M, Suganuma K, Kogure M, Kirihara O (2011) Printable and stretchable conductive wirings comprising silver flakes and elastomers. IEEE Electron Device Lett 32(10):1424–1426
Yim M-J, Paik K-W (1998) Design and understanding of anisotropic conductive films (ACF’s) for LCD packaging. IEEE Trans Compon Packag Manuf Technol 21(2):226–234
IEC 60068-2-67, Environmental testing—Part 2: Tests—Test Cy: Damp heat, steady state, accelerated test primarily intended for components (1995).
Kim S-S, Kim K-S, Lee K, Kim S, Suganuma K, Tanaka H (2011) Electrical resistance and microstructural changes of silver-epoxy isotropic conductive adhesive joints under high humidity and heat. J Electron Mater 40(2):232–238
Kim K-S, Lee K, Suganuma K, Huh S-H (2011) Effect of Cl content on interface characteristics of isotropic conductive adhesives/Sn plating interface. J Microelectron Packag Soc 18(3):33–37
Klosterman D, Li L, Morris J (1998) Materials characterization, conduction development, and curing effects on reliability of isotropically conductive adhesives. IEEE Trans Compon Packag Manuf Technol 21(1):23–31
ISO 16525-2 Adhesives—Test methods for electrically isotropic conductive adhesives—Electric characteristic for electronic assemblies (DC test) (2013).
Author information
Authors and Affiliations
Rights and permissions
Copyright information
© 2014 Springer Science+Business Media New York
About this chapter
Cite this chapter
Suganuma, K. (2014). Interconnection. In: Introduction to Printed Electronics. SpringerBriefs in Electrical and Computer Engineering, vol 74. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-9625-0_6
Download citation
DOI: https://doi.org/10.1007/978-1-4614-9625-0_6
Published:
Publisher Name: Springer, New York, NY
Print ISBN: 978-1-4614-9624-3
Online ISBN: 978-1-4614-9625-0
eBook Packages: EngineeringEngineering (R0)