Abstract
Printed electronics also requires advanced materials technology for substrates. The requirements include flexibility, excellent transparency in many cases, surface smoothness, thin and light weight, low thermal expansion, stiffness, heat resistance, low cost, and others. Several choices are available as substrates depending on the nature of the PE product. Of course, it is possible not to make any choice of substrate but direct printing on the cases with a 3D printing technology. But using certain flexible substrates will be the major for mass production and ultimately will be applied to a roll-to-roll process.Table 5.1 lists materials commonly used in PE products.
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Suganuma, K. (2014). Substrate and Barrier Film. In: Introduction to Printed Electronics. SpringerBriefs in Electrical and Computer Engineering, vol 74. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-9625-0_5
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DOI: https://doi.org/10.1007/978-1-4614-9625-0_5
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