Abstract
Thermal stress occurring during the packaging and operating processes influences the performance and reliability of high power semiconductor lasers. The stress is mainly caused by the coefficients of the thermal expansion (CTE) mismatch between the mounting substrate and laser chip. Ideally, packaging materials with high thermal conductivities and CTEs matching those of the semiconductor materials such as GaAs, InP, and GaN are desired in high power diode laser packaging. Thermal stress is one of the most critical problems in packaging of high-power diode lasers. In this chapter, effects of the thermal stress on the optical, electrical, and mechanical performances of the semiconductor lasers are investigated, such as wavelength, polarization, smile, and cracking. Formation of thermal stress in high power semiconductor laser is discussed, and approaches to reduce the thermal stress are proposed.
This is a preview of subscription content, log in via an institution to check access.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
References
R. Diehl, High-Power Diode Lasers: Fundamentals, Technology, Applications (Springer, Berlin, 2000)
C. Scholz, Thermal and mechanical optimization of diode laser bar packaging, PhD thesis, RWTH Aachen University of Technology, 2007
M.L. Biermann, S. Duran, K. Peterson, A. Gerhardt, J.W. Tommaet, A. Bercha, W. Trzeciakowski, Spectroscopic method of strain analysis in semiconductor quantum-well devices. J. Appl. Phys. 96(8), 4056–4065 (2004)
J. Singh, Semiconductor Optoelectronics, Physics and Technology (McGraw-Hill, New York, 1995)
M. Leers, K. Boucke, C. Scholz, T. Westphalen, Next generation of cooling approaches for diode laser bars. Proc. SPIE 6456, 64561A(1–10) (2007)
http://www.dilasinc.com/gdresources/downloads/whitepapers/DILAS_DPAL_8241-25.pdf
J.L. Hostetler, C.L. Jiang, V. Negoita, T. Vethake, R. Roff, A. Shroff, T. Li, C. Miester, U. Bonna, G. Charache, H. Schlüter, F. Dorsch, Thermal and strain characteristics of high-power 940 nm laser arrays mounted with AuSn and In solders. Proc. SPIE 6456, 645502(1–12) (2007)
A.R. Dhamdhere, A.P. Malshe, W.F. Schmidt, W.D. Brown, Investigation of reliability issues in high power laser diode bar packages. Microelectron. Reliab. 43(2), 287–295 (2003)
A. Hodges, J. Wang, M. DeFranza, X.S. Liu, B. Vivian, C. Johnson, P. Crump, P. Leisher, M. DeVito, R. Martinsen, J. Bell, A CTE matched, hard solder, passively cooled laser diode package combined with nXLT™ facet passivation enables high power, high reliability operation. Proc. SPIE 6552, 65521E(1–9) (2007)
J.W. Wang, Z.B. Yuan, L.J. Kang, K. Yang, Y.X. Zhang, X.S. Liu, Study of the Mechanism of “Smile” in High Power Diode Laser Arrays and Strategies in Improving Near-Field Linearity. IEEE 2009 Electronic Components and Technology Conference (2009), pp. 837–842
D. Schleuning, K. Scholz, M. Griffin, B. Guo, C. Luong, R. Pathak, C. Scholz, J. Watson, H. Winhold, T. Hasenberg, Material survey for packaging semiconductor diode lasers. Proc. SPIE 7198, 71981K(1–9) (2009)
M. Ohring, Reliability and Failure of Electronic Materials and Devices (Academic Press, Boston, 1998)
C. Scholz, K. Boucke, R. Poprawe, Mechanical stress reducing heat sinks for high-power diode lasers. Proc. SPIE 5336, 176–187 (2004)
F. Bachmann, P. Loosen, R. Poprawe, High Power Diode Lasers Technology and Applications. Springer series in optical sciences (2007), pp. 75–120
A.C. Pliska, J. Mottin, N. Matuschek, C. Bosshard, Bonding Semiconductor Laser Chip: Substrate Material Figure of Merit and Die Attach Layer Influence, Therminic, 2005, pp. 28–30
D. Lorenzen, P. Hennig, Highly thermally conductive substrates with adjustable CTE for diode laser bar packaging. Proc. SPIE 4945, 174–185 (2003)
M. Leers, C. Scholz, K. Boucke, M. Oudart, Next Generation Heat Sinks for High-Power Diode Laser Bars. 23rd IEEE semi-therm symposium (2007), p. 105
E. Neubauer, P. Angerer, Advanced Composite Materials With Tailored Thermal Properties for Heat Sink Applications. 2007 European Conference: Power Electronics and Applications (2007), pp. 1–8
Author information
Authors and Affiliations
Rights and permissions
Copyright information
© 2015 Springer Science+Business Media New York
About this chapter
Cite this chapter
Liu, X., Zhao, W., Xiong, L., Liu, H. (2015). Thermal Stress in High Power Semiconductor Lasers. In: Packaging of High Power Semiconductor Lasers. Micro- and Opto-Electronic Materials, Structures, and Systems. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-9263-4_4
Download citation
DOI: https://doi.org/10.1007/978-1-4614-9263-4_4
Published:
Publisher Name: Springer, New York, NY
Print ISBN: 978-1-4614-9262-7
Online ISBN: 978-1-4614-9263-4
eBook Packages: EnergyEnergy (R0)