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Copper Electrodeposition for Nanofabrication of Electronics Devices pp 193–227Cite as

Build-up Printed Wiring Boards (Build-up PWBs)

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Part of the book series: Nanostructure Science and Technology ((NST))

Abstract

Build-up printed wiring boards (build-up PWBs) are advanced forms of plated through hole printed wiring boards (PTH PWBs). Not only build-up PWBs but also PTH PWBs are based on the technologies used to achieve high density and multilayer PWBs, which are currently demanded. Build-up PWBs are considered to improve on the weak points of PTH PWBs. In order to achieve more advanced high density PWBs, progressive manufacturing technologies have been introduced. One of the most important technologies is filled via copper deposition, as mentioned in the previous chapters. The filled vias can be stacked on the vias in the lower layer, resulting in better electrical performance and greater wiring density than those achieved with conformal vias. Therefore the application of via filling is expanding. The details are described later in Sect. 9.7.3.

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References

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Author information

Authors and Affiliations

  1. Takagi Associates, 4-12-10 Hongodai, Sakae-Ku, Yokohama-shi, 247-0008, Japan

    Kiyoshi Takagi

  2. Packaging Lab, Toppan Printing Co, 4-2-3 Takanodaiminami, Sugito-Cho, Kitakatushika-Gun, Saitama, 345-8508, Japan

    Toshikazu Okubo

Authors
  1. Kiyoshi Takagi
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  2. Toshikazu Okubo
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Corresponding author

Correspondence to Kiyoshi Takagi .

Editor information

Editors and Affiliations

  1. Dept. of Chemical Engineering, Osaka Prefecture University, Osaka, Japan

    Kazuo Kondo

  2. Intel Corporation, Hillsboro, Oregon, USA

    Rohan N. Akolkar

  3. Dept. of Chemical Engineering, University of New Hampshire, Durham, New Hampshire, USA

    Dale P. Barkey

  4. Industrial Technology Support Institute, Osaka Prefecture, Japan

    Masayuki Yokoi

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Takagi, K., Okubo, T. (2014). Build-up Printed Wiring Boards (Build-up PWBs). In: Kondo, K., Akolkar, R., Barkey, D., Yokoi, M. (eds) Copper Electrodeposition for Nanofabrication of Electronics Devices. Nanostructure Science and Technology. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-9176-7_9

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