• Tamanna Alam
  • Poh Seng Lee
  • Li-Wen Jin
Part of the SpringerBriefs in Applied Sciences and Technology book series (BRIEFSAPPLSCIENCES)


Thermal management has become a critical issue for high performance technology in defense electronic systems designs [1]. Defense electronic devices, such as the High Energy Laser (HEL) and the Active radar system, have increased in power consumption and reduced in physical size. This increased power density has led to an increasing intensity in heat generation. Thermal management is a series of systematic steps to remove this excessive generated heat during normal operation. Heat dissipation from defense applications is at heat fluxes of the order of 1,000 W/cm2 [2, 3]. This high heat dissipation rate is primarily due to the greater functionalities and higher packaging densities. To ensure safe and reliable operations of electronic devices, there is a need for high capacity thermal management techniques. It therefore seems likely that new techniques will be needed in the near future.


Thermal management Microchannel Microgap channel Flow boiling Flow visualization Heat transfer Pressure drop Instability Hotspot 


  1. 1.
    Lee J, Mudawar I (2009) Low-temperature two-phase microchannel cooling for high-heat-flux. Thermal management of defense electronics. IEEE Trans Compon Packag Technol 32(2):453–465CrossRefGoogle Scholar
  2. 2.
    Pokharna H, Masahiro K, DiStefanio E, Mongia R, Crowley BJ, Chen W, Izenson M (2004) Microchannel cooling in computing platforms: performance needs and challenges in implementation. Second international conference on microchannels and minichannels (ICMM), pp 109–118Google Scholar
  3. 3.
    Kandlikar SG, Bapat AV (2007) Evaluation of jet impingement, spray and microchannel chip cooling options for high heat flux removal. Heat Transf Eng 28(11):911–923CrossRefGoogle Scholar
  4. 4.
    Kim DW, Rahim E, Bar-Cohen A, Han B (2008) Thermofluid characteristics of two-phase flow in micro-gap channels. 11th IEEE intersociety conference on thermal and thermomechanical phenomena in electronic systems (I-THERM), pp 979–992Google Scholar
  5. 5.
    Bar-Cohen A, Rahim E (2009) Modeling and prediction of two-phase refrigerant flow regimes and heat transfer characteristics in microgap channel. Heat Transfer Eng 30(8):601–625CrossRefGoogle Scholar
  6. 6.
    Kim DW, Rahim E, Bar-Cohen A, Han B (2010) Direct submount cooling of high-power LEDs. IEEE Trans Compon Packag Technol 33(4):698–712CrossRefGoogle Scholar
  7. 7.
    Sheehan J, Bar-Cohen A (2010) Spatial and temporal wall temperature fluctuations in two-phase flow in microgap coolers. In: Proceedings of the ASME 2010 international mechanical engineering congress and exposition (IMECE), pp 12–18Google Scholar
  8. 8.
    Kabov OA, Zaitsev DV, Cheverda VV, Bar-Cohen A (2011) Evaporation and flow dynamics of thin, shear-driven liquid films in microgap channels. Exp Thermal Fluid Sci 35:825–831CrossRefGoogle Scholar
  9. 9.
    Utaka Y, Okuda S, Tasaki Y (2009) Configuration of the micro-layer and characteristics of heat transfer in a narrow gap mini/micro-channel boiling system. Int J Heat Mass Transf 52:2205–2214CrossRefGoogle Scholar
  10. 10.
    Bar-Cohen A, Wang P (2012) Thermal management of on-chip hot spot. J Heat Transf 134:1–11CrossRefGoogle Scholar

Copyright information

© The Author(s) 2014

Authors and Affiliations

  1. 1.Department of Mechanical EngineeringNational University of SingaporeSingaporeSingapore
  2. 2.Department of Building Environment and Energy ApplicationsXi’an Jiaotong UniversityXi’anPeople’s Republic of China

Personalised recommendations