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Copper Wire Bonding pp 111–131Cite as

Wire Bond Pads

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Abstract

This chapter examines the pad materials and finishes for wire bonding. Cu wire bonding on Al and Cu pads is discussed. The common pad finishes, including NiAu, NiPdAu, PdAu, electroless nickel immersion gold, electroless nickel/electroless palladium/immersion gold, and electroplated silver, are considered. The effect of the thickness of surface finish layers on bond strength is also explained. The chapter also discusses the effects of surface treatment on the reliability of wire bonds. The sources of contamination on bond pads, including fluorine, chlorine, carbon, oxygen, silicon, and titanium, are examined, along with their influence on wire bond reliability. The effect of lead surface contamination and pad surface roughness on wire bond strength is considered. The surface treatments, including organic coating to prevent pad oxidation and plasma cleaning to remove surface contaminants, are also explained.

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Authors and Affiliations

  1. Center for Advanced Life Cycle Engineering (CALCE), University of Maryland, College Park, MD, USA

    Preeti S. Chauhan & Michael G. Pecht

  2. Industry Consultant, Marlborough, MA, USA

    Anupam Choubey

  3. School of Mechanical & Aerospace Engineering, Nanyang Technological University, Singapore, Singapore

    ZhaoWei Zhong

Authors
  1. Preeti S. Chauhan
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  2. Anupam Choubey
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  3. ZhaoWei Zhong
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  4. Michael G. Pecht
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Chauhan, P.S., Choubey, A., Zhong, Z., Pecht, M.G. (2014). Wire Bond Pads. In: Copper Wire Bonding. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-5761-9_7

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  • DOI: https://doi.org/10.1007/978-1-4614-5761-9_7

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