Thermal Reliability Tests

  • Preeti S. Chauhan
  • Anupam Choubey
  • ZhaoWei Zhong
  • Michael G. Pecht
Chapter

Abstract

This chapter covers the thermal reliability tests conducted on Cu wire bonds. High-temperature storage (HTS) tests on Cu and PdCu wires on Al-, Au-, and Ni-based pads are discussed, and reliability test data are provided. Comparisons are made between the HTS strengths of Cu and PdCu wires. The effect of HTS on Pd distribution, as well as its effect on wire bond strength, is discussed. Cu wire bond reliability under thermal cycling and thermal shock testing is also presented.

Keywords

Fatigue Convection Bromide Mold Epoxy 

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Copyright information

© Springer Science+Business Media New York 2014

Authors and Affiliations

  • Preeti S. Chauhan
    • 1
  • Anupam Choubey
    • 2
  • ZhaoWei Zhong
    • 3
  • Michael G. Pecht
    • 1
  1. 1.Center for Advanced Life Cycle Engineering (CALCE)University of MarylandCollege ParkUSA
  2. 2.Industry ConsultantMarlboroughUSA
  3. 3.School of Mechanical & Aerospace EngineeringNanyang Technological UniversitySingaporeSingapore

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