Abstract
Some of the efficient cooling methods, such as free air cooling, extend the operating environment of telecom equipment, which may impact the performance of electronic parts. Parts located at hotspots may not function as required or may have unacceptable parameter variations resulting in inadequate performance. This chapter introduces the background information and methods necessary to identify the parts at risk.
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Notes
- 1.
Not all datasheets are public. A part may be built for a specific application and the datasheet for this part may be a proprietary internal document.
- 2.
Some EIA/JEDEC documents refer to absolute maximum ratings as absolute maximum “continuous” ratings. In those documents, transient conditions under which these ratings may be exceeded are defined.
- 3.
Some manufacturers, such as Philips and Freescale, provide supplementary information on how to estimate power dissipation for some of their parts and part families.
- 4.
Parts usually go through reflow soldering where the whole package is exposed to radiative and/or convective heat. The lead temperature and exposure time limit together provide a safeguard so that the package and the circuitry are not damaged by exposure to high temperatures. For insertion-mount parts, which are usually wave soldered, the part bodies are not exposed to direct heat, and this rating has generally not been considered essential.
- 5.
The mounting torque of a screw-mounted device determines the quality of thermal contact between the part and the board. Thus, mounting torque impacts the heat flow from a part to the board.
- 6.
The junction temperature limit specified in the absolute maximum ratings of the part datasheet cannot be used as an uprating parameter because reliability is not guaranteed.
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Dai, J., Ohadi, M.M., Das, D., Pecht, M.G. (2014). Part Risk Assessment and Mitigation. In: Optimum Cooling of Data Centers. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-5602-5_6
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