Conclusions and Future Directions

  • Nauman Khan
  • Soha Hassoun
Part of the SpringerBriefs in Electrical and Computer Engineering book series (BRIEFSELECTRIC)


This book investigates challenges associated with TSVs in 3-D ICs. This work is innovative as it explores design and technology challenges, evaluates potential benefits, and proposes novel solutions. The results presented in this book advance the understanding of TSV-based 3-D IC design and guide designers in selecting design and technology parameters.


Power Delivery Substrate Noise Book Advance Device Blockage Select Design 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.


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© The Authors 2013

Authors and Affiliations

  • Nauman Khan
    • 1
  • Soha Hassoun
    • 1
  1. 1.Department of Computer ScienceTufts UniversityMedfordUSA

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