Abstract
This chapter describes the method of manufacturing microfluidic microchannels formed by delaminated buckled thin films. Thin films under compression tend to delaminate and buckle. Microchannel geometry can be controlled by tailoring film residual stress and placing patterned adhesion-weakening layers utilizing photolithographic techniques. Results based on the photoresist as the adhesion weakening layer and compressed tungsten thin films are described along with the corresponding thin film mechanics.
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Volinsky, A.A., Waters, P. (2013). Delaminated Film Buckling Microchannels. In: Chen, X. (eds) Mechanical Self-Assembly. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-4562-3_8
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DOI: https://doi.org/10.1007/978-1-4614-4562-3_8
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