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Semiconductor Manufacturing Process Description

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Production Planning and Control for Semiconductor Wafer Fabrication Facilities

Part of the book series: Operations Research/Computer Science Interfaces Series ((ORCS,volume 52))

Abstract

In this chapter, we provide a process description of semiconductor manufacturing. Therefore, we describe the front-end and back-end areas in some detail. We introduce the notion of base system, base process, control system, control process, planning system, planning process, and finally of the information system from systems theory. Then we discuss important wafer fabrication operations including a description of the most important characteristics of the semiconductor manufacturing process. We also introduce the notion of complex job shops because this is the way wafer fabs are organized. Finally, we discuss the production planning and control (PPC) hierarchy in semiconductor manufacturing.

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Authors and Affiliations

  1. Department of Mathematics and Computer Science, University of Hagen, Universitätsstraße 1, Hagen, Germany

    Lars Mönch

  2. W.P. Carey School of Business Department of Supply Chain Management, Arizona State University, Tempe, AZ, USA

    John W. Fowler

  3. Department of Industrial Engineering, Clemson University, Freeman Hall 124, Clemson, SC, USA

    Scott J. Mason

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Mönch, L., Fowler, J.W., Mason, S.J. (2013). Semiconductor Manufacturing Process Description. In: Production Planning and Control for Semiconductor Wafer Fabrication Facilities. Operations Research/Computer Science Interfaces Series, vol 52. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-4472-5_2

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