Instantaneous Phase-Stepping Photoelasticity and Hybrid Stress Analysis for a Curving Crack Under Thermal Load
Stress fields around an oscillating crack tip in a thin plate are analyzed using a hybrid method of photoelasticity and finite element analysis. Instantaneous phase-stepping photoelasticity using a CCD camera equipped with a pixelated micro-retarder array is used for measuring the stress fields around a propagating crack tip in a quenched thin glass plate. The distributions of the principal direction as well as the principal stress difference around a growing crack are obtained. Then, the values of the principal direction and the principal stress difference are used for determining the boundary condition for a local finite element model. Using the boundary condition that is determined from the measurement results inversely, the stress distributions around a crack are evaluated. It is shown that the stresses around the crack tip can be evaluated using the proposed hybrid method. Results show that the proposed hybrid method is effective for the study of crack growth behavior in the quenched glass plate.
KeywordsStress Intensity Factor Principal Direction Crack Growth Behavior Nodal Force Crack Line
- 16.Sakaue K, Takashi M (2006) Experimental investigation of crack path instabilities in a quenched plate. In: Proceedings of the 2006 SEM annual conference and exposition on experimental and applied mechanics. Society for experimental mechanics, Bethel, Paper number 164Google Scholar
- 17.Smith CW, Kobayashi AS (1993) Experimental fracture mechanics. In: Kobayashi AS (ed) Handbook on experimental mechanics. VCH Publishers, New York, pp 905–968Google Scholar
- 22.Yoneyama S, Arikawa S, Kobayashi Y (2012) Linear and nonlinear algorithms for stress separation in photoelasticity. Exp Mech 52(5):529–538Google Scholar