Printed RFID and Smart Objects for New High Volume Applications

Part of the Integrated Circuits and Systems book series (ICIR)


Printed electronics opens up completely new application fields for electronics, where there is no electronics today. By printing conductive, semi conductive, dielectric and other functional materials in roll-to-roll processes on plastic films it is possible to realize electronic devices that are thin, flexible, low cost and available in very high volumes. Even though the overall performance of such printed electronic devices is typically lower compared to standard silicon based electronics, printed electronics could be integrated directly into packaging, to make consumer goods smart: e.g. integrated radio frequency identification (RFID) tags that transmit information in an electronic way or so called Smart Objects that enable, for example, dynamical optical elements to appear on packages, tickets or brand products. The technology of printed electronics is young and still not mature, therefore it is important to start with first products in niche markets where the advantages of printed electronics are obvious and where both the manufacturer and the user can learn about the use of such devices. To enter mass markets, some challenges still need to be faced, especially in the field of material and process optimization, but also at the system level, in order to find the best ways to integrate printed electronics with low cost goods. This chapter describes the status quo, first products and market outlook for printed electronics with a focus on printed RFID and printed Smart Objects.


Printed electronics Organic electronics RFID Smart objects Printing technology 


  1. 1.
    Fix W (2010) R2R printed electronics. In: Presentation at Lope-C conference. Frankfurt, Germany, 1–2 June 2010Google Scholar
  2. 2.
    Zielke D, Hübler A, Hahn U, Brandt N, Bartzsch M, Fügmann U (2005) Polymer-based organic field-effect transistor using offset printed source/drain structures. App Phys Lett 87:123508CrossRefGoogle Scholar
  3. 3.
    Klink G, Hammerl E, Drost A, Hemmetzberger D, Bock K (2005) Reel-to-reel fabrication of integrated circuits based on soluble polymer semiconductor. In: Presentation at IEEE Polytronic 2005Google Scholar
  4. 4.
    Jung M, Jung K, Lim SY, Lee K, Kim DA, Kim J, Tour KM, Cho G (2009) All R2R printable 4-bits digital signal processor for printed RFID Using SWNT-TFTs”, ICFPE, Jeju Island, KoreaGoogle Scholar
  5. 5.
    M enard E, Meitl MA, Sun Y, Park JU, Shir DJL, Nam YS, Jeon S, Rogers JA (2007) Micro- and nanopatterning techniques for organic electronics and optoelectronic systems. Chem Rev 107(4):1117–1160CrossRefGoogle Scholar
  6. 6.
    Jacob S, Gwoziecki R, Verilhac JM, Benwadih M, Seiler AL, Bory C, Bablet J, Heitzmann M, Tallal J, Altazin S, Boudinet D, Courant Y, Fischer V, Mohamed F, Frères P, Sicard G, Chartier I, Coppard R, Serbutoviez C (2010) Full printed organic CMOS circuits for large area electronics. In: Presentation at Lope-C conference. Frankfurt, Germany, 1–2 June 2010Google Scholar
  7. 7.
    Knobloch A, Manuelli A, Bernds A, Clemens W (2004) Fully printed integrated circuits from solution processable polymers. J Appl Phy 96(4):2286–2291CrossRefGoogle Scholar
  8. 8.
    Fix W (2007) Polymer based 13 MHz RFID transponders. In: Organic electronics conference 2007, Frankfurt, Germany, 24–26 Sept 2007Google Scholar
  9. 9.
    Fix W (2009) R2R printed electronics. In: Presentation at Lope-C conference. Frankfurt, Germany, 23–25 June 2009Google Scholar
  10. 10.
    Fix W (2004) Fast and stable integrated polymer circuits. At OSC conference. Cambridge, UK, 27–28 Sept 2004Google Scholar
  11. 11.
    Krumm J, Clemens W (2010) Printed electronics—first circuits, products, and roadmap. AACD Workshop, Graz, 23–25 Mar 2010Google Scholar
  12. 12.
    Volkman SK, Mattis BA, Molesa SE, Lee JB, de la Fuente Vornbrock A, Bakhishev T, Subramanian V (2004) A novel transparent air-stable printable n-type semiconductor technology using ZnO nanoparticles. In: International Electron Device Technical Digest, 2004, pp. 769–773Google Scholar
  13. 13.
    Kovio, Inc. (2011) Kovio achieves printed electronics milestone with world’s first all-printed high-performance silicon thin-film transistor, press release. Accessed 2011
  14. 14.
    Crawford RH (1967) MOSFET in circuit design. McGraw-Hill, New YorkGoogle Scholar
  15. 15.
    De Vusser S, Genoe J, Heremans P (2006) Influence of transistor parameters on the noise margin of organic digital circuits. IEEE Trans Electron Devices 53(4):601–610CrossRefGoogle Scholar
  16. 16.
    Krumm J (2008) Circuit analysis methodology for organic transistor. Dissertation, University of Erlangen-Nuremberg, GermanyGoogle Scholar
  17. 17.
    Crone BK, Dodabalapur A, Sarpeshkar R, Filias RW, Lin YY, Bao Z, O’Neill JH, Li W, Katz E (2001) Design and fabrication of organic complementary circuits. J Appl Phys 89(9):5125–5132CrossRefGoogle Scholar
  18. 18.
    Yoo B, Madgavkar A, Jones BA, Nadkarni S, Facchetti A, Dimmler K, Wasielewski MR, Marks TJ, Dodabalapu A (2006) Organic complementary D flip-flops enabled by perylene diimides and pentacene. IEEE Electron Device Lett 27(9):737–739CrossRefGoogle Scholar
  19. 19.
    Blache R, Krumm J, Fix W (2009) Organic CMOS Circuits for RFID Applications. In: IEEE International Solid State Circuits Conference, pp. 208–209Google Scholar
  20. 20.
    Ng T, Sambandan S, Lujan RA, Arias AC, Newman C, Yan H, Facchetti A (2009) Electrical stability of inkjet-patterned organic complementary inverters measured in ambient conditions. App Phys Lett 94:233307CrossRefGoogle Scholar
  21. 21.
    Yan H, Chen Z, Zheng Y, Newman C, Quinn JR, Dötz F, Kastler M, Facchetti A (2009) A high-mobility electron-transporting polymer for printed transistors. Nature 457:679–686CrossRefGoogle Scholar
  22. 22.
    Organic Electronics Association (2009) Organic and printed electronics, 3rd edn. VDMA Verlag, Frankfurt, Germany. (
  23. 23.
    European Commission (2009) Report on EU customs enforcement of intellectual property rights—results at the EU border 2009. Accessed 2011

Copyright information

© Springer Science+Business Media New York 2013

Authors and Affiliations

  1. 1.PolyIC GmbH and Co. KGFüerthGermany
  2. 2.Materials AcceleratorC/o University of AucklandAucklandNew Zealand

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