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Solder Joint Reliability in Solid-State Lighting Applications

  • J. Kloosterman
  • R. Kregting
  • M. Erinc
  • W. D. van Driel
Chapter
Part of the Solid State Lighting Technology and Application Series book series (SSLTA, volume 1)

Abstract

Lighting is an advancing phenomenon both on the technology and on the market level due to the rapid development of the solid-state lighting technology. The interest in solder joint reliability has increased by the introduction of the so-called high brightness leadless type of packages. Solder joint reliability is one of the main failure modes in these package types, especially when it comes down to lifetimes beyond 20,000 h. Many end customers require lifetime prediction data with respect to board-level reliability. As it is time consuming to determine the endurance performance of each package separately, we have to look for means to reduce test time. A possible method is to actually determine the lifetime of a few products within one product family, and use the obtained results to verify and improve advanced simulation-based prediction models. The improved models will subsequently be used to predict the reliability performance of the entire product family in question. A new and innovative approach to accurately predict the board-level performance of LED packages is proposed.

Keywords

Solder Joint Creep Strain Soldering Temperature Solder Material Accelerate Life Test 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science+Business Media, LLC 2013

Authors and Affiliations

  • J. Kloosterman
    • 1
  • R. Kregting
    • 2
  • M. Erinc
    • 2
  • W. D. van Driel
    • 1
    • 3
  1. 1.Philips LightingEindhovenThe Netherlands
  2. 2.TNO IndustryEindhovenThe Netherlands
  3. 3.Delft University of TechnologyEindhovenThe Netherlands

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