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SSL Case Study: Package, Module, and System

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Solid State Lighting Reliability

Part of the book series: Solid State Lighting Technology and Application Series ((SSLTA,volume 1))

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Abstract

As early as 2004, high power LED was expected to be the dominant lighting technology by 2025. Nowadays, this tendency is becoming more and more obvious based on the higher luminous efficiency and reliability. Many case studies, like thermal design and analysis, junction temperature measurement, reliability assessment, etc., focus on package and module level product. However, for actual application of solid state lighting (SSL) system, only a few studies are carried out by now. Generally, the material degradation and structure damage due to the electrical, thermal, chemical, and mechanical stress will lead to the lumen degradation, color variation or even early death of LEDs. It is clear that SSL system reliability is a challenging and important task that needs to be addressed. In this chapter, the LED reliability issues are divided into four categories according to the LED product forms, which are reliability of LED package, reliability of LED module, reliability of multichip LED module, and reliability of LED system. Several case studies are used to illustrate each kind of LED reliability issues by theoretical/numerical modeling, reliability test, various methods and experiments.

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Acknowledgments

The authors acknowledge the support of the National Science and Technology Support Program (grant no. 2011BAE01B14) and the Education Department of Guangxi Province for their financial support (Major Project, grant no. 201101ZD007). The research work was also supported by Guangxi Key Laboratory of Manufacturing System & Advanced Manufacturing Technology Grant No. GuiKeNeng09-007-05_001 and No. GuiKeNeng 11-031-12_001). The authors express thanks to Zaifu Cui, Hongyu Tang, Wanchun Tian, Ming Gong, Lili Liang, Fengze Hou and Lei Liu for their contributions.

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Authors and Affiliations

  1. Guilin University of Electronic Technology, Guilin, China

    Daoguo Yang & Miao Cai

Authors
  1. Daoguo Yang
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  2. Miao Cai
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Correspondence to Daoguo Yang .

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Editors and Affiliations

  1. Philips Lighting, Mathildelaan 1, Eindhoven, 5611, Netherlands

    W.D. van Driel

  2. Dept. of Mechanical Eng., Lamar University, Redbird Lane 211, Beaumont, 77710, Texas, USA

    X.J. Fan

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Yang, D., Cai, M. (2013). SSL Case Study: Package, Module, and System. In: van Driel, W., Fan, X. (eds) Solid State Lighting Reliability. Solid State Lighting Technology and Application Series, vol 1. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-3067-4_17

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  • DOI: https://doi.org/10.1007/978-1-4614-3067-4_17

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  • Publisher Name: Springer, New York, NY

  • Print ISBN: 978-1-4614-3066-7

  • Online ISBN: 978-1-4614-3067-4

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