Requirements of Thermal Management Materials



In this chapter, we will present the requirements of thermal management materials from a physics point of view. First, the mechanism of a metal electron and the mechanism of a metal lattice on thermal conductivity are discussed in detail. Next, the effects of atomic structure, chemical composition, porosity, and temperature on thermal conductivity are presented. In the following section, we will introduce methods to measure thermal conductivity, the coefficient of thermal expansion, and hermeticity. Finally, the emergence of quality requirements for thermal management materials are discussed.


Thermal Conductivity Thermal Diffusivity Free Path Thermal Resistance Heat Carrier 
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  1. 1.
    Chinese Society for Metals, Nonferrous Metals Society of China (1987) The physical properties of metallic materials handbook • Volume. Metallurgical Industry Press, Beijing, pp 299–320Google Scholar
  2. 2.
    Kun H (1988) Solid state physics. Higher Education Press, HebeiGoogle Scholar
  3. 3.
    Xide X, Junxin F (1961) Solid state physics (Volume). Shanghai Science and Technology Press, ShanghaiGoogle Scholar
  4. 4.
    Zhang Ying and nine (1997) Mater Rev 11(3): 52Google Scholar
  5. 5.
    German RM et al (1994) Powder Metallurgy Processing of Thermal Management Materials for Microelectronics Applcations. Int J of Powder Metall 30(2): 205Google Scholar
  6. 6.
    Bin Y, Renjie W, Zhang set (1994) Metal matrix composites for electronic packaging research and development. Mater Rev (3):64–66Google Scholar
  7. 7.
    Zweben C (1992) Metal-matrix composites for electronic packaging. JOM 44(7):P15–P24CrossRefGoogle Scholar
  8. 8.
    Zweben C (1998) Advances in composite materials for thermal management in electronic packaging. JOM 50(6):47–51CrossRefGoogle Scholar
  9. 9.
    Huang Qiang Gu, Ming-yuan JY (2000) Electronic packaging materials research. Mater Rev 14(9):28–32Google Scholar
  10. 10.
    The king of voice (2000) Multi-chip module (MCM) packaging technology. Microelectron 2(4):40–45Google Scholar
  11. 11.
    Liang SQ (2000) Epoxy resin in the packaging material of profiles. Thermosetting resin 15(1):47–51Google Scholar
  12. 12.
    Fan Y, Zhao Y-M (2001) Epoxy resins for electronic packaging research and development. Electron Process Technol 22(6):238–241Google Scholar
  13. 13.
    CF Legzdins etal (1997) MMCX - An expert system for metal matrix composite selection and design. Can Metall Quart 36(3): 177–178Google Scholar
  14. 14.
    Liang G (2003) Actively develop domestic microelectronics packaging industry. China Electron Bus 13(6):86–88Google Scholar
  15. 15.
    Strand SD (2005) Future technology in the global market. Power Systems World, 23–27 Oct 2005Google Scholar
  16. 16.
    Markoff J (2004) Intel’s big shift after hitting technical wall, New York Times, 17 May 2004Google Scholar
  17. 17.
    Zweben C, Schmidt KA (1989) Advanced composite packaging materials. In: Electronic materials handbook. ASM International, Materials ParkGoogle Scholar
  18. 18.
    Lasance CJM (2003) Problems with thermal interface material measurements: suggestions for improvement. Electron Cooling 9(4):22–29Google Scholar
  19. 19.
    Fleming TF, Levan CD, Riley WC (1995) Applications for ultra-high thermal conductivity fibers. In: Proceedings of the 1995 international electronic packaging conference, International Electronic Packaging Society, pp 493–503Google Scholar
  20. 20.
    Norley J (2004) Natural graphite based materials for electronics cooling. In: Proceedings of the IMAPS advanced technology workshop on thermal management, 25–27 Oct 2004Google Scholar
  21. 21.
    Zweben C (2001) Electronic packaging: heat sink materials. Encycl Mater: Science Technol 3:2676–2683CrossRefGoogle Scholar
  22. 22.
    Thaw J, Zemany J, Zweben C (1987) Metal matrix composites for microwave packaging components. Electronic Packaging and Production, pp 27–29Google Scholar
  23. 23.
    Zweben C (2006) Thermal materials solve power electronics challenges. Power Electron Technol 3(2):40–47Google Scholar

Copyright information

© Springer Science+Business Media New York 2013

Authors and Affiliations

  1. 1.College of Materials Science and EngineeringCentral South UniversityChangshaChina
  2. 2.Brewer ScienceSpringfieldUSA
  3. 3.Torrey Hills TechnologiesSan DiegoUSA

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