Abstract
Heat generated by electronic devices and circuitry must be dissipated to improve reliability and prevent premature failure. Thermal management goes hand in hand with microelectronics packaging. In this chapter, we will present the motivations and the basic concepts of thermal management by heat sink materials, such as heat flux, thermal resistance, and thermal circuits. Next we will introduce the levels and classifications of packaging and the functions of microelectronics packaging. Finally, we will introduce the development stages of thermal management materials.
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Jiang, G., Diao, L., Kuang, K. (2013). Introduction to Thermal Management in Microelectronics Packaging. In: Advanced Thermal Management Materials. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-1963-1_1
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DOI: https://doi.org/10.1007/978-1-4614-1963-1_1
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