Using Molecular Modeling Trending to Understand Dielectric Susceptibility in Dielectrics for Display Applications
Dielectric materials are universally used in the fabrication and packaging of microelectronic and display devices, as well as used in discrete devices such as sensors, switches and photovoltaics. However, as device and interconnect sizes become smaller, the question of the source of electrical failure becomes more and more important. During the development of these materials it has been found that small changes in the molecular structure can lead to small increases in conductivity which is undesirable for most applications. Although important to the final commercial acceptance of the dielectric, leakage current is often one of the final properties measured when developing the chemistry of the dielectric, so a dielectric with very good mechanical properties can ultimately fail at end-user applications due to the poor electrical properties. Knowledge of the susceptibility for electrical failure can be a great aid to the developer, and molecular modeling used in a trend analysis has been found useful to predict tendencies.
KeywordsMercury Silicate Cage Encapsulation Polyimide
The authors would like to acknowledge discussions held with Stephen Yates and Kenneth Heffner of Honeywell Aerospace that helped us justify looking into at band-structure trends for leakage susceptibility.
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