Advertisement

A Thermoelastic Failure Criterion at the Micron Scale in Electronic Devices

  • Zohar Yosibash
Chapter
Part of the Interdisciplinary Applied Mathematics book series (IAM, volume 37)

Abstract

Here we demonstrate the application of the SED failure criterion to a “real-life” engineering problem involving thermoelasticity effects in a microscale electronic device discussed in [205]. The fabrication of microelectronic devices (chips) is a multistep process aimed at creating a layered structure made of semiconductors, metals, and insulators.

Keywords

Failure Criterion Passivation Layer Micron Scale Plasma Power Metal Line 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

Copyright information

© Springer Science+Business Media, LLC 2012

Authors and Affiliations

  • Zohar Yosibash
    • 1
  1. 1.Department of Mechanical EngineeringBen-Gurion University of the NegevBeer-ShevaIsrael

Personalised recommendations