A Thermoelastic Failure Criterion at the Micron Scale in Electronic Devices

  • Zohar Yosibash
Part of the Interdisciplinary Applied Mathematics book series (IAM, volume 37)


Here we demonstrate the application of the SED failure criterion to a “real-life” engineering problem involving thermoelasticity effects in a microscale electronic device discussed in [205]. The fabrication of microelectronic devices (chips) is a multistep process aimed at creating a layered structure made of semiconductors, metals, and insulators.


Failure Criterion Passivation Layer Micron Scale Plasma Power Metal Line 
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Copyright information

© Springer Science+Business Media, LLC 2012

Authors and Affiliations

  • Zohar Yosibash
    • 1
  1. 1.Department of Mechanical EngineeringBen-Gurion University of the NegevBeer-ShevaIsrael

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