A Thermoelastic Failure Criterion at the Micron Scale in Electronic Devices
Here we demonstrate the application of the SED failure criterion to a “real-life” engineering problem involving thermoelasticity effects in a microscale electronic device discussed in . The fabrication of microelectronic devices (chips) is a multistep process aimed at creating a layered structure made of semiconductors, metals, and insulators.
KeywordsFailure Criterion Passivation Layer Micron Scale Plasma Power Metal Line
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