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Dynamic Mechanical Reliability Test and Analysis

  • John Hock Lye Pang
Chapter

Abstract

Chapter 7 focuses on vibration and drop impact test investigation. Experimental testing and FEA of the vibration mode and frequency for clamped–clamped PCB assemblies were compared. Constant amplitude vibration fatigue tests were conducted for the FCOB assemblies and test data were developed for 3G, 5G, and 10G respectively. Variable amplitude vibration fatigue tests for an increasing block loading of 3G-to-5G-to-10G repeated loading was conducted to develop cumulative damage index (CDI) vibration fatigue analysis methods using board-level fatigue data and solder material-level fatigue data. The Global–Local Sub-modeling technique developed was used in a quasi-static vibration fatigue analysis method for predicting the vibration fatigue life of the block loading test results. Impact drop testing is increasingly employed by many electronic product manufacturers to evaluate the product reliability to accidental or repeated drop events. Impact drop test and solder joint reliability investigations for Pb-based and Pb-free soldered assemblies were investigated. Explicit dynamic FEA modeling and simulation of the board-level drop test were used to predict the transient vibration deformation and acceleration from the drop test result. Dynamic stress strain analysis of the solder joints reveals fairly high plastic strain range generated and fatigue life prediction confirms the low cycle fatigue failure mechanism.

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Copyright information

© Springer Science+Business Media, LLC 2012

Authors and Affiliations

  1. 1.School of Mechanical and Aerospace EngineeringNanyang Technological UniversitySingaporeSingapore

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