An in-situ experimental-numerical approach for interface delamination characterization
Interfacial delamination is a key reliability challenge in composites and micro-electronic systems due to (high density) integration of dissimilar materials. Predictive finite element models are used during the design and optimization stage to minimize delamination failures, however, they requires a relevant interface model to capture the (irreversible) crack initiation and propagation behavior observed in experiments. Therefore, a set of experimental-numerical tools is presented to enable accurate characterization of delamination mechanism(s) and prediction of the interface mechanics. First, a novel Miniature Mixed Mode Bending (MMMB) delamination setup is presented that enables in-situ SEM characterization of interface delamination mechanisms while sensitively measuring global load-displacement curves for the full range of mode mixities. Accurate determination of the critical energy release rate from the global load-displacement curve requires, however, identification and separation of bulk plastic contributions from the measured total energy dissipation; to this end, an analytical procedure is presented. Finally, a cohesive zone model suitable for mixed mode loading with realistic coupling is presented that can capture the range of interface failure mechanisms from damage to plasticity, as observed in-situ with SEM, as well as a parameter identification procedure. The set of experimental-numerical tools is validated on delamination measurements of a glue interface.
KeywordsLinear Elastic Fracture Mechanic Cohesive Zone Ultra High Molecular Weight Polyethylene Fracture Process Zone Cohesive Zone Model
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- 2.K. Bose, P. A.Mataga, and P. P. Castaneda. Improved impact and delamination resistance through interleafing. Journal Key Engineering Materials, 37:317–348, 1991.Google Scholar
- 3.O. van der Sluis, C. A. Yuan, W. D. van Driel, and G. Q. Zhang. Nanopackaging. Springer US, 2009.Google Scholar
- 9.R. Okada and M. T. Kortschot. The role of the resin fillet in the delamination of honeycomb sandwich structures. Composites Science and Technology, 62:1811–1819, 2002.Nix, W. D., "Mechanical properties of thin films," Metall.Trans.A., 20, 11, pp. 2217–2245, 1989.Google Scholar
- 10.C. C. Ciang, J-R. Lee, and H-J. Bang. Structural health monitoring for a wind turbine system: a review of damage detection methods. Measurement Science and Technology, 19(122001):1–20, 2008.Google Scholar
- 17.Jy-An. J. Wang, I. G. Wright, M. J. Lance, and K. C. Liu. A new approach for evaluating thin film interface fracture toughness. Material Science and Engineering A, 426:332–345, 2006.Google Scholar
- 18.I. Ocãna, J. M. Molina-Aldareguia, D. Gonzalez, M. R. Elizalde, J. M. Sáanchez, J. M. Martnez-Esnaola, J. Gil Sevillano, T. Scherban, D. Pantuso, B. Sun, G. Xu, B. Miner, J. He, and J. Maiz. Fracture characterization in patterned thin films by cross-sectional nanoindentation. Acta Materialia, 54:3453–3462, 2006.CrossRefGoogle Scholar
- 19.Yu-Fu Liu, Y. Kagawa, and A. G. Evans. Analysis of a barb test for measuring the mixed-mode delamination toughness of coatings. ActaMaterialia, 56:43–49, 2008.Google Scholar
- 21.W. O. Soboyejo, G. Y. Lu, S. Chengalva, J. Zhang, and V. Kenner. A modified mixed-mode bending specimen for the interfacial fracture testing of dissimilar materials. Fatigue and Fracture of Engineering Materials and Structures, 22:799–810, 1999.Google Scholar
- 22.C. C.Merrill and P. S. Ho. Effect of mode mixity and porosity on interface fracture of low-k dielectrics. In Materials Research Society Symposium Proceedings, volume 812, 2004.Google Scholar
- 28.L. Banks-Sills, NahumTravitzky, and Dana Ashkenazi. Interface fracture properties of a bimaterial ceramic composite. Mechanics of Materials, 32:711–722, 2000.Google Scholar
- 31.S. Tang, T. F. Guo, and L. Cheng. Rate dependent interface delamination in plastic IC packages. In 9th Electronics packaging technology conference, pages 680–685, 2007.Google Scholar
- 34.M. Kolluri, An in-situ experimental-numerical approach for interface delamination characterization, PhD thesis, Eindhoven University of Technology, 2011, in press.Google Scholar