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On-Line Process Control Compositional Analysis of Aluminum Films Containing a Low Percentage of Copper

  • G. H. Glade
  • J. M. Matthews
  • F. R. Titcomb

Abstract

Aluminum film conducting stripes are widely used for semiconductor device interconnection networks. The addition of a low percentage of copper significantly increases their life. Composition must be controlled to maintain product quality.

The paper discusses various methods used to analyze the copper composition in the aluminum films, and adaptation of one of these methods for process control application. A portable instrument designed for field use was adapted for use as an on-line instrument.

Keywords

Aluminum Film Laboratory Instrument Copper Percentage Atomic Absorption Method Copper Mass 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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References

  1. 1.
    I. Ames, F. M. d’Heurle and R. E. Horstman, “Reduction of Electromigration in Aluminum Films by Copper Doping,” IBM J. Res. and Develop., July 1970, pp. 461–463.Google Scholar
  2. 2.
    H. A. Liebhafsky, H. G. Pfeiffer, E. H. Winslow and P. D. Zemany, X-Ray Absorption and Emission in Analytical Chemistry, p. 313, John Wiley and Sons (1960).Google Scholar

Copyright information

© Springer Science+Business Media New York 1972

Authors and Affiliations

  • G. H. Glade
    • 1
  • J. M. Matthews
    • 1
  • F. R. Titcomb
    • 1
  1. 1.IBM Components DivisionEssex JunctionUSA

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