Electromigration modeling for smart power applications
Solid state devices are being increasingly produced for automobiles, both as sensors and actuators. They have been introduced, for example, in fuel injection devices, in exhaust pipe for oxygen sensing and control, and in anti-lock brakes. Such devices were discussed in detail in Chapters 20 and 22 of . On May 13, 1994 Leonard Borucki from Motorola described smart power device used in fuel injection. This is the same device (which was presented by him) as in Chapter 22 of . However the earlier mathematical modeling dealt with the temperature only, whereas the present concern is with a more thorough modeling which includes electromigration, in which transport of metal ions in the grain boundaries result in void formation and growth, and eventual failure. At this level of modeling thermoelastic stress must also be included.
KeywordsFuel Injection Void Formation Exhaust Pipe Solid State Device Impose Boundary Condition
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