Thermal Stress in Cylindrical Glass Seals in Microelectronic Packages Under Thermal Shock
In order to ensure the reliability of microelectronic packages, these packages are subjected to various tests which simulate the environments which the packages may experience in service. The present study concerns a detailed investigation of the Thermal Shock Test (Method 1011.2 in MIL-STD-883B ).
Unable to display preview. Download preview PDF.
- 1.MIL-STD-883B, Method 1011, “Test Methods and Procedures for Microelectronics,” August 31, 1977.Google Scholar
- 2.R.W. Thomas, “IC Packages and Hermetically Sealed-in Contaminants.” NBS Special Publication 400–9, pp. 4–19, (Dec. 1974).Google Scholar
- 3.C.M. Johnson and L.K. Conaway, “Reliability Evaluation of Hermetic Dual in Line and Flat Microcircuit Packages,” McDonnell-Douglas Unclassified Report, Contract NAS8-31446, Oct. 1976–Dec. 1977.Google Scholar
- 4.M.P. Borom and R.A. Giddings, “Considerations in Designing Glass/Metal Compression Seals to Withstand Thermal Excursions,” Amer. Ceram. Soc. Bull., 55 , (Dec. 1976).Google Scholar
- 7.K. Kokini, R.W. Perkins, C. Libove, “Thermal Stress Analysis of Glass Seals in Microelectronic Packages Under Thermal Shock Conditions.” Final Technical Report, No. RADC-TR-79-201, Rome Air Development Center, New York, (July 1979).Google Scholar