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Thermal Stress in Cylindrical Glass Seals in Microelectronic Packages Under Thermal Shock

  • Klod Kokini
  • Richard W. Perkins
  • Charles Libove

Abstract

In order to ensure the reliability of microelectronic packages, these packages are subjected to various tests which simulate the environments which the packages may experience in service. The present study concerns a detailed investigation of the Thermal Shock Test (Method 1011.2 in MIL-STD-883B [1]).

Keywords

Thermal Stress Thermal Shock Radial Stress Glass Seal Concentric Cylinder 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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References

  1. 1.
    MIL-STD-883B, Method 1011, “Test Methods and Procedures for Microelectronics,” August 31, 1977.Google Scholar
  2. 2.
    R.W. Thomas, “IC Packages and Hermetically Sealed-in Contaminants.” NBS Special Publication 400–9, pp. 4–19, (Dec. 1974).Google Scholar
  3. 3.
    C.M. Johnson and L.K. Conaway, “Reliability Evaluation of Hermetic Dual in Line and Flat Microcircuit Packages,” McDonnell-Douglas Unclassified Report, Contract NAS8-31446, Oct. 1976–Dec. 1977.Google Scholar
  4. 4.
    M.P. Borom and R.A. Giddings, “Considerations in Designing Glass/Metal Compression Seals to Withstand Thermal Excursions,” Amer. Ceram. Soc. Bull., 55 [12], (Dec. 1976).Google Scholar
  5. 5.
    H. Poritsky, “Analysis of Thermal Stresses in Sealed Cylinders and the Effect of Viscous Flow During Anneal,” Physics 5, pp. 406–411, (1934).CrossRefGoogle Scholar
  6. 6.
    B.E. Gatewood, “Thermal Stresses in Long Cylindrical Bodies,” Phil. Mag. Ser. 7, 32, pp. 282–301, (1941).MathSciNetGoogle Scholar
  7. 7.
    K. Kokini, R.W. Perkins, C. Libove, “Thermal Stress Analysis of Glass Seals in Microelectronic Packages Under Thermal Shock Conditions.” Final Technical Report, No. RADC-TR-79-201, Rome Air Development Center, New York, (July 1979).Google Scholar

Copyright information

© Plenum Press, New York 1980

Authors and Affiliations

  • Klod Kokini
    • 1
  • Richard W. Perkins
    • 1
  • Charles Libove
    • 1
  1. 1.Department of Mechanical & Aerospace EngineeringSyracuse UniversitySyracuseUSA

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