Thermal Stress in Cylindrical Glass Seals in Microelectronic Packages Under Thermal Shock
In order to ensure the reliability of microelectronic packages, these packages are subjected to various tests which simulate the environments which the packages may experience in service. The present study concerns a detailed investigation of the Thermal Shock Test (Method 1011.2 in MIL-STD-883B ).
KeywordsThermal Stress Thermal Shock Radial Stress Glass Seal Concentric Cylinder
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