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Thermal Stresses: A Survey

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Thermal Stresses in Severe Environments

Abstract

I want to thank the organizers of this Congress for asking me to present the opening lecture. I thought it would be appropriate if I were to start with a rapid review of the field of thermal stresses and give some thoughts regarding an assessment (although necessarily a very personal one) of the present state of the field, and finally include guesses as to what the future might bring.

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Author information

Authors and Affiliations

  1. The Technological Institute, Northwestern University, Evanston, Illinois, 60201, USA

    Bruno A. Boley

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  1. Bruno A. Boley
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Editors and Affiliations

  1. Virginia Polytechnic Institute and State University, Blacksburg, Virginia, USA

    D. P. H. Hasselman  & R. A. Heller  & 

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© 1980 Plenum Press, New York

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Boley, B.A. (1980). Thermal Stresses: A Survey. In: Hasselman, D.P.H., Heller, R.A. (eds) Thermal Stresses in Severe Environments. Springer, Boston, MA. https://doi.org/10.1007/978-1-4613-3156-8_1

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  • DOI: https://doi.org/10.1007/978-1-4613-3156-8_1

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4613-3158-2

  • Online ISBN: 978-1-4613-3156-8

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