Abstract
A study has been made of the recrystallization of W-wire, activated by coatings of Ni, Pt and Fe, and of the diffusivity of these metals in the W grain boundaries. The recrystallization is activated significantly by Ni and Pt but much less so by Fe. The effective grain boundary diffusion of the former two in W is also significantly faster than that of Fe. For all three metals the diffusion is faster in a recrystallizing grain structure than in stationary, recrystallized grain boundaries. The active metals form a distinct grain-boundary layer, about 2 nm thick, behind the advancing recrystallization front. The slow diffusion and non-activity of Fe seems to be associated with the existence of the stable intermetallic phase Fe7W6. Above 1910 K, the dissociation temperature of this coumpound, Fe behaves as an activator.
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© 1987 Plenum Press, New York
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Kozma, L., Henig, ET., Warren, R. (1987). Metal Activated Recrystallization and Creep of Tungsten Fibres. In: Kuczynski, G.C., Uskoković, D.P., Palmour, H., Ristić, M.M. (eds) Sintering’85. Springer, Boston, MA. https://doi.org/10.1007/978-1-4613-2851-3_15
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DOI: https://doi.org/10.1007/978-1-4613-2851-3_15
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