Epoxy Adhesion to Copper, Part II: Electrochemical Pretreatment
Electrochemical methods of pretreating copper surfaces for adhesive bonding were studied. The objective of the electrochemical pretreatment was to control the oxide layer under the copper-coupling agent complex film, since this layer was found to be the locus of failure of copper/epoxy bonds aged in boiling water. Both cathodic and anodic pretreatments resulted in improved durability of the joint after exposure. Experiments were also performed to understand the mechanism of weakening of copper/epoxy bonds in boiling water.
KeywordsOxide Layer Boiling Water Copper Surface Cathodic Potential Joint Strength
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