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Epoxy Adhesion to Copper, Part II: Electrochemical Pretreatment

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Adhesive Joints

Abstract

Electrochemical methods of pretreating copper surfaces for adhesive bonding were studied. The objective of the electrochemical pretreatment was to control the oxide layer under the copper-coupling agent complex film, since this layer was found to be the locus of failure of copper/epoxy bonds aged in boiling water. Both cathodic and anodic pretreatments resulted in improved durability of the joint after exposure. Experiments were also performed to understand the mechanism of weakening of copper/epoxy bonds in boiling water.

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References

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Author information

Authors and Affiliations

  1. Department of Chemical Engineering and Institute of Materials Science, University of Connecticut, Storrs, Connecticut, 06268, USA

    Jae M. Park & James P. Bell

Authors
  1. Jae M. Park
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  2. James P. Bell
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Editor information

Editors and Affiliations

  1. IBM Corporation, Hopewell Junction, New York, USA

    K. L. Mittal

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© 1984 Plenum Press, New York

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Park, J.M., Bell, J.P. (1984). Epoxy Adhesion to Copper, Part II: Electrochemical Pretreatment. In: Mittal, K.L. (eds) Adhesive Joints. Springer, Boston, MA. https://doi.org/10.1007/978-1-4613-2749-3_31

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  • DOI: https://doi.org/10.1007/978-1-4613-2749-3_31

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4612-9702-4

  • Online ISBN: 978-1-4613-2749-3

  • eBook Packages: Springer Book Archive

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