Nondestructive Evaluation of Some Bonded Joints

  • T. C. Ward
  • Margaret Sheridan
  • D. L. Kotzev


Free films and lap-shear bonded metal joints were compared with respect to their linear dynamic viscoelastic behavior. Thermosetting and thermoplastic adhesives were investigated. Damping phenomena and relative shear moduli indicated a broader mechanical relaxation occurring at higher temperatures in the bonded assemblies. Triblock copolymer model adhesives were used to illustrate the importance of sample preparation in the evaluation of bonded materials.


Block Copolymer Storage Modulus Nondestructive Evaluation Adhesive Joint Bulk Polymer 
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Copyright information

© Plenum Press, New York 1984

Authors and Affiliations

  • T. C. Ward
    • 1
  • Margaret Sheridan
    • 1
  • D. L. Kotzev
    • 1
    • 2
  1. 1.Chemistry Department and Polymer Materials and Interfaces LaboratoryVirginia Polytechnic Institute and State UniversityBlacksburgUSA
  2. 2.Scientific-Industrial Center for Special PolymersSofiaBulgaria

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