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Low Curing Temperature CTBN-Toughened Epoxy Adhesive

  • Nie Xuzong
  • Wang Lijuan
  • Xue Ruilan
  • Li Yiming
  • Yu Yunchao
Part of the Polymer Science and Technology book series (POLS, volume 29)

Abstract

A carboxyl-terminated butadiene-acrylonitrile copolymer (CTBN)-toughened epoxy adhesive cured with 2-ethyl-4-methyl-imidazole (EMI) is described. In the presence of EMI the reaction of carboxyl end-group of the liquid rubber with epoxy group is very rapid, it is practically completed before the appearance of phase separation or gelation. At low CTBN concentrations thie in situ formed domain are discrete globules, which toughen the resin matrix. Aggregation of the dispersed phase begins at the CTBN concentration 30 parts per hundred parts resin (phr); at much higher CTBN concentrations the rubber phase becomes continuous. The EMI concentration is a critical factor for the toughening of the adhesive. A room-temperature lap shear strength maximum of adhesive joint was found at CTBN concentration in the range of 30 to 40 phr. The epoxy adhesive KH-225, toughened with CTBN, has superior fatigue strength to those modified with a nonfunctional liquid butadiene-acrylonitrile copolymer or a liquid statistical copolymer of butadiene-acrylonitrile-acrylic acid.

Keywords

Epoxy Group Adhesive Joint Epoxy Adhesive Liquid Rubber Tensile Shear Test 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Plenum Press, New York 1984

Authors and Affiliations

  • Nie Xuzong
    • 1
  • Wang Lijuan
    • 1
  • Xue Ruilan
    • 1
  • Li Yiming
    • 1
  • Yu Yunchao
    • 1
  1. 1.Institute of Chemistry Academia SinicaBeijingChina

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