Abstract
Diffusion bonds between 1.5 mm thick slices of polycrystalline Ni and single crystal Al203(basal plane parallel to the bonding plane) have been produced. Bonding was performed in a vacuum of 10−3Pa, at temperatures close to the melting point of nickel. Scanning electron microscope observations of the interfacial regions indicated that an approximately one micron thick layer of an intermediate phase was produced during bonding. By electron diffraction, the intermediate phase was identified as nickel aluminate spinel. The spinel phase was crystallographically related to the Al203 such that the close-packed planes and the close-packed directions of the anion lattices were nearly parallel. The spinel phase also contained a high density of microstructural defects. The interface between the spinel and the nickel was often facetted.
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© 1987 Plenum Press, New York
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Wasynczuk, J.A., Rühle, M. (1987). Microstructural Characterization Of Ni/Al2O3 Diffusion Bonds. In: Pask, J.A., Evans, A.G. (eds) Ceramic Microstructures ’86. Materials Science Research, vol 21. Springer, Boston, MA. https://doi.org/10.1007/978-1-4613-1933-7_35
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DOI: https://doi.org/10.1007/978-1-4613-1933-7_35
Publisher Name: Springer, Boston, MA
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