Adhesion and Crosslink Gradient in a Photoresist

  • R. L. Geary
  • S. V. Babu
  • J. Stephanie


Using chloroform and hexane as extraction solvents, we determined the fraction of reacted monomer as a function of exposure energy in a Riston®** photoresist film. We have also measured adhesion at the resist-substrate interface and find that adhesion is inversely correlated to the crosslinking at the interface.


Copper Substrate Percent Elongation Adhesion Measurement Registered Trademark Exposure Energy 
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Copyright information

© Plenum Press, New York 1987

Authors and Affiliations

  • R. L. Geary
    • 1
  • S. V. Babu
    • 1
  • J. Stephanie
    • 2
  1. 1.Department of Chemical EngineeringClarkson UniversityPotsdamUSA
  2. 2.Systems Technology DivisionIBM CorporationEndicottUSA

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