Adhesion and Crosslink Gradient in a Photoresist
Using chloroform and hexane as extraction solvents, we determined the fraction of reacted monomer as a function of exposure energy in a Riston®** photoresist film. We have also measured adhesion at the resist-substrate interface and find that adhesion is inversely correlated to the crosslinking at the interface.
KeywordsCopper Substrate Percent Elongation Adhesion Measurement Registered Trademark Exposure Energy
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- 3.J. H. O’Donnell and P. W. O’Sullivan, Polymer Bulletin, 5, 103 (1981).Google Scholar
- 4.M. B. Moran and G. C. Martin, Polymer Preprints, 24 (2), 141 (1983).Google Scholar
- 5.R. L. Geary, Master’s Thesis, Dept. of Chem. Eng., Clarkson University, Potsdam, NY, 1985.Google Scholar
- 6.J. L. Anderson, in “Characterization of Metals and Polymer Surfaces,“ L. H. Lee, editor, Vol. 2, p. 409, Academic Press, New York, 1977.Google Scholar
- 7.V. Srinivasan and S. V: Babu, Photograph. Sci. Eng., 28 (5), 175 (1984).Google Scholar
- 8.K. L. Mittal, Solid State Tech., 89–95, 100 (May 1979).Google Scholar
- 9.K. L. Mittal and R. O. Lussow, in “Adhesion and Adsorption of Polymers,“ L. H. Lee, editor, pp. 503–520, Plenum Press, New York, 1980.Google Scholar
- 10.C. A. Deckert, in “Adhesion Measurement of Thin Films, Thick Films and Bulk Coatings,“ K. L. Mittal, editor, pp. 307–340, American Society for Testing and Materials, Philadelphia, 1980.Google Scholar
- 11.J. L. Parker, Jr. and R. B. Ranes, in “Proc. of the American Electroplaters Society 2nd Design and Finishing Printed Wiring and Hybrid Circuits Symposium” held in San Francisco, CA, January, 1980.Google Scholar