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Adhesion and Crosslink Gradient in a Photoresist

  • R. L. Geary
  • S. V. Babu
  • J. Stephanie

Abstract

Using chloroform and hexane as extraction solvents, we determined the fraction of reacted monomer as a function of exposure energy in a Riston®** photoresist film. We have also measured adhesion at the resist-substrate interface and find that adhesion is inversely correlated to the crosslinking at the interface.

Keywords

Copper Substrate Percent Elongation Adhesion Measurement Registered Trademark Exposure Energy 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Plenum Press, New York 1987

Authors and Affiliations

  • R. L. Geary
    • 1
  • S. V. Babu
    • 1
  • J. Stephanie
    • 2
  1. 1.Department of Chemical EngineeringClarkson UniversityPotsdamUSA
  2. 2.Systems Technology DivisionIBM CorporationEndicottUSA

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