Abstract
Very thin Silicon dioxide layers (thickness less than 100 Ä) have a growing importance for the VLSI integrated circuits. Indeed they are used in EEPROM (memories) and in a variety of bistable devices (as the MISS for example). Besides they could be used as intermediate dielectric tunnel layers serving to enhance injection in Schottky contacts for bipolar circuit applications.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
G. Pananakakis, G. Kamarinos, M. El-Sayed, Solid. St, Electron, 26:415 (1983).
F. Gaspard, A. Halimaoui, G. Sarrabayrouse, Revue Phys. Appl., 22:65 (1987).
J.L. Prom, F. Rossel, C. Solano, T. Doconto, G. Sarrabayrouse, Journées GCIS, 18–19 Mai 1987, Toulouse.
G. Pananakakis, G. Kamarinos, Surface Science, 168:657 (1980).
E.H. Nicollian, A. Goetzberger, The Bell System J., XLVI:1055 (1967).
M. El-Sayed, G. Pananakakis, G. Kamarinos, Solid. St. Electron, 28:345 (1985).
T.C. Poom, H.C. Card, J. Appl. Phys., 51:6273 (1980).
C.N. Berglund, IEEE Trans., ED-13:701 (1966).
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 1988 Plenum Press, New York
About this chapter
Cite this chapter
Pananakakis, G., Morfouli, P., Kamarinos, G. (1988). Influence of Different Preparation Methods on Interfacial (SiO2/Si) Parameters of Very Thin SiO2 Layers. In: Devine, R.A.B. (eds) The Physics and Technology of Amorphous SiO2 . Springer, Boston, MA. https://doi.org/10.1007/978-1-4613-1031-0_40
Download citation
DOI: https://doi.org/10.1007/978-1-4613-1031-0_40
Publisher Name: Springer, Boston, MA
Print ISBN: 978-1-4612-8301-0
Online ISBN: 978-1-4613-1031-0
eBook Packages: Springer Book Archive