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Evaluation of Solder Bonds in a Silicon Flip Chip Device

  • J. T. Fanton
  • C.-H. Chou
  • B. T. Khuri-Yakub
  • G. S. Kino

Abstract

Recently we adapted two nondestructive testing techniques for the evaluation of electrical connections between a silicon device wafer and an inverted silicon interconnect chip. We used a focused acoustic microscope to check the mechanical quality of the connections, and a photothermal probe to measure their electrical conductivity. With the combination of these two techniques, we can differentiate between good bonds, partial disbonds, and complete open circuits. We can also determine the type of disbond.

Keywords

Solder Joint Thermal Image Shot Noise Solder Bump Acoustic Image 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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References

  1. 1.
    J. T. Fanton and G. S. Kino, Appl. Phys. Lett. 51 (2), 66–69 (July 1987).CrossRefGoogle Scholar

Copyright information

© Plenum Press, New York 1988

Authors and Affiliations

  • J. T. Fanton
    • 1
  • C.-H. Chou
    • 1
  • B. T. Khuri-Yakub
    • 1
  • G. S. Kino
    • 1
  1. 1.Edward L. Ginzton Laboratory, W. W. Hansen Laboratories of PhysicsStanford UniversityStanfordUSA

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