Abstract
The scanning electron microscope (SEM) has unique capabilities for high resolution examination of surface structure and composition. Due to the resolution limits of optical inspection techniques, the semiconductor manufacturing industry has become a rapidly expanding field for SEM applications. As microcircuit groundrules (minimum feature sizes) continue to shrink below one micrometer non-optical measurement methods such as scanning electron microscopy must play an increasingly important role in the inspection of semiconductor device structures at various stages during their fabrication [1,2]. The measurement of structure dimensions such as circuit linewidths (or the spaces between lines) [3] and the measurement of circuit overlay [4] requires a minimum resolution of better than 1/10 groundrule dimensions. In fact, many manufacturing line managers state their resolution requirement as less than 1/20 groundrule dimensions, particularly during the development of a new process. Similarly, it is now apparent from device failure analysis that defects as small as 1/10 groundrule dimensions must also be detected and measured.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
K. S. Maher and H. R. Rottman, SPIE 565, 160 (1985).
P. W. Grant, SPIE 565, 169 (1985).
M. G. Rosenfield, SPIE 775,. 70 (1987).
K. L. Harris, S. Miyauchi, and T. Namae, SPIE 775, 180 (1987).
O. C. Wells, Scanning Electron Microscopy (McGraw-Hill, Inc., USA, 1974), p. 2.
H. Drescher, L. Reimer, and H. Seidel, Z. f. angew. Physik 29, 331 (1977).
K-R. Peters, Scanning Electron Microsc. 1982 IV, 1359 (1982).
M. T. Postek, Review of Progress in Quantitative NDE, 6B, D. O. Thompson and D. E. Chimenti, Eds., (Plenum Press, New York, 1987), p. 1327.
M. T. Postek and D. C. Joy, Solid State Technol. 29(11), 145 (1986)
M. T. Postek and D. C. Joy, Solid State Technol. 29(12), 77 (1986).
Examples include the Vickers 3006, Hitachi S-6000, S-8000 and S-800 series, KLA/Holon 2711, ISI/Akashi MEA-3000, Nanometrics Cwickscan IIIE, and others.
G. D. Danilatos, Scanning 4, 9 (1981)
G. D. Danilatos, Scanning 7 26 (1985).
M. T. Postek, R. D. Larrabee, and W. J. Keery, “Scanning Electron Microscope Linewidth Measurement Standards Program at the National Bureau of Standards,” EMSA Bulletin (in press).
D. C. Joy, Scanning Microsc. 2, in press (1988).
O. C. Wells, Scanning Electron Microscopy (McGraw-Hill, Inc., USA, 1974) p. 65.
O. C. Wells, Scanning 1 58 (1978)
O. C. Wells and P. J. Bailey, J. Microsc. 138(1), RP3 (1985).
N. Hashimoto, H. Todokoro, S. Fukuhara, and K. Senoo, Jap. J. Appl. Phys., 21–1, 199 (1982).
M. Mioshi, M. Ishikawa, and K. Okumura, Scanning Electron Microsc. 1982 IV, 1507 (1982).
R. A. Odula, IEEE Trans. Electron Devices ED-26, 644 (1979).
E. H. Snow, A. S. Grove, and D. J. Fitzgerald, Proc. IEEE 55, 1168 (1967).
T. P. Ma, G. Scoggan, and R. Leone, Appl. Phys. Lett. 27, 61 (1975).
J. M. Aitken and D. R. Young, J. Appl. Phys. 49, 3386 (1978).
J. M. Aitken, J. Electronic Materials 9, 639 (1980).
J. M. Aitken and C. Y. Ting, Proc. Int. Electron Devices Meeting, (1981), p. 50.
H. Shimaya, N. Shiono, O. Nakajima, C. Hashimoto, and Y. Sakakibara, J. Electrochem. Soc. 130, 945 (1983).
J. Frosien and B. Lischke, Microcircuit Engineering 84, 441 (1985).
M. Brunner and R. Schmid, Scanning Electron Microsc. 1986 II, 380 (1986).
J. Cazaux, J. Appl. Phys. 59, 1418 (1986).
S. Erasmus, Proc. 30th Ann. Cof. Electron, Ion, and Photon Beams, (1986), p. 409.
F. Dacol and S. Utterback, Scanning Microsc. 1(III), 1045 (1987).
H. S. Carslaw and J. C. Jaeger, Conduction of Heat in Solids. 2nd ed. (Clarendon Press, Oxford, England, 1959), p. 216.
A. Iranmanesh and R. F. W. Pease, J. Vac. Sci. Technol. B1, 91 (1983).
B. R. Stallard and Y. Bukhman, SPIE 775, 60 (1987).
D. E. Schrope, Scanning Microsc. 1(III), 1055 (1987).
F. Rohrlich and B. C. Carlson, Phys. Rev. 93, 38 (1954).
W. Reuter, J. D. Kuptsis, A. Lurio, and D. F. Kyser, J. Phys. D: Appl. Phys. 11, 2633 (1978).
K. Kanaya and S. Okayama, J. Phys. D: Appl. Phys. 5, 43 (1972).
T. E. Everhart and P. H. Hoff, J. Appl. Phys. 42, 5837 (1971).
D. F. Kyser and K. Murata, IBM J. Res. Develop. 18, 352 (1974).
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 1988 Plenum Press, New York
About this chapter
Cite this chapter
Utterback, S.G. (1988). Semiconductor Dimensional Metrology Using the Scanning Electron Microscope. In: Thompson, D.O., Chimenti, D.E. (eds) Review of Progress in Quantitative Nondestructive Evaluation. Springer, Boston, MA. https://doi.org/10.1007/978-1-4613-0979-6_32
Download citation
DOI: https://doi.org/10.1007/978-1-4613-0979-6_32
Publisher Name: Springer, Boston, MA
Print ISBN: 978-1-4612-8275-4
Online ISBN: 978-1-4613-0979-6
eBook Packages: Springer Book Archive