X-Ray Diffractional Investigation of the Copper-Aluminium Interface Reaction
For the application of the copper wire ball/wedge bonding it is necessary to analyze the wire/substrate transition regions. The investigation of the interface reaction between copper ball and aluminium bonding pads serves for the assessment of the contact reliability at the copper ball bonds from the points of view of solid state physics.
KeywordsBall Bond Copper Ball Contact Reliability Thin Film Bilayer Phase CuAl
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- 6.E. Zschech, J. Uhlig, and I. Geleji-Neubauer, A study of phase formation in copper-aluminium couples by in-situ X-ray diffraction, in preparation.Google Scholar