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X-Ray Diffractional Investigation of the Copper-Aluminium Interface Reaction

  • Ehrenfried Zschech
  • Andreas Kaiser

Abstract

For the application of the copper wire ball/wedge bonding it is necessary to analyze the wire/substrate transition regions. The investigation of the interface reaction between copper ball and aluminium bonding pads serves for the assessment of the contact reliability at the copper ball bonds from the points of view of solid state physics.

Keywords

Ball Bond Copper Ball Contact Reliability Thin Film Bilayer Phase CuAl 
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References

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Copyright information

© Plenum Press, New York 1989

Authors and Affiliations

  • Ehrenfried Zschech
    • 1
  • Andreas Kaiser
    • 1
  1. 1.Forschungsinstitut für NichteisenmetalleFreibergGermany

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