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Surface Preparation for Adhesive Bonding

  • C. Lynn Mahoney

Abstract

Adhesive bonding is unique among structural fabrication methods in having surface and interface properties so dominant in controlling bond formation and bond performance properties. A single molecular layer of contaminant can prevent proper wetting by the adhesive, or a weak substrate boundary layer can provide the “weak link” for premature failure. For these reasons, much adhesive application effort and technical study has been focused on the adhesive-substrate interface. With metals, surface characteristics are largely determined by the nearly always present oxide layer; this layer must be strongly adhering and resistant to humidity, etc., or it must be removed or specifically replaced by a more controlled oxide surface. With polymeric surfaces, successful bonding requires removal of contaminants, such as mold release residues, etc. In some cases, weak, low molecular weight fragments, which can be pushed to the polymer surface during crystallization processes, etc., must be removed.

Keywords

Contact Angle Solubility Parameter Adhesive Bond Emery Paper Peel Strength 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Van Nostrand Reinhold, New York, NY 1990

Authors and Affiliations

  • C. Lynn Mahoney
    • 1
  1. 1.Dexter Adhesives and Structural Materials DivisionThe Dexter CorporationPittsburgUSA

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