Surface Preparation for Adhesive Bonding

  • C. Lynn Mahoney


Adhesive bonding is unique among structural fabrication methods in having surface and interface properties so dominant in controlling bond formation and bond performance properties. A single molecular layer of contaminant can prevent proper wetting by the adhesive, or a weak substrate boundary layer can provide the “weak link” for premature failure. For these reasons, much adhesive application effort and technical study has been focused on the adhesive-substrate interface. With metals, surface characteristics are largely determined by the nearly always present oxide layer; this layer must be strongly adhering and resistant to humidity, etc., or it must be removed or specifically replaced by a more controlled oxide surface. With polymeric surfaces, successful bonding requires removal of contaminants, such as mold release residues, etc. In some cases, weak, low molecular weight fragments, which can be pushed to the polymer surface during crystallization processes, etc., must be removed.


Contact Angle Solubility Parameter Adhesive Bond Emery Paper Peel Strength 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.


Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.


  1. 1.
    Fowkes, F. M., in “Chemistry and Physics of Interfaces; A.C.S. Symposium on Interfaces, June 15, 16, 1964, “Sydney Ross, Chairman. Washington, D.C., American Chemical Society Publications.Google Scholar
  2. 2.
    Burrell, H., in “Polymer Handbook,” 2nd Ed., J. Bandrup and E. H. Immergut, eds., Vol. IV, p. 337, New York, John Wiley and Sons, 1975.Google Scholar
  3. 3.
    Barton, A. F. M., “Handbook of Solubility Parameters and Other Cohesion Parameters” Boca Raton, Florida, CRC Press, 1983.Google Scholar
  4. 4.
    Ranee, D. G., in “Industrial Adhesion Problems” D. M. Brewis and D. Briggs, eds., pp. 49–62, New York, John Wiley and Sons, 1985.Google Scholar
  5. 5.
    Ranee, D. G., Ref. 4, p. 62.Google Scholar
  6. 6.
    Zisman, W. A., in “Handbook of Adhesives” 2nd Ed., Irving Skeist, ed., New York, Van Nostrand Reinhold Company, 1977.Google Scholar
  7. 7.
    Kaelble, D. K., Dynes, P. J., and Cirlin, E. H., J. Adhesion, 6, 23–48 (1974).CrossRefGoogle Scholar
  8. 8.
    Iyegar, Y., and Erickson, D. E., J. Appl. Poly. Sci,. 11, 2311 (1967).CrossRefGoogle Scholar
  9. 9.
    DeBruyne, N A., Nature, 180 (Aug. 10), 262 (1957).Google Scholar
  10. 10.
    Schonhorn, H., in “Polymer Surfaces” D. T. Clark and W. J. Feast, eds., New York, John Wiley and Sons, 1978.Google Scholar
  11. 11.
    Herczeg A, Ronay, G S and Simpson, W, C “National SAMPE Technical Conference Proceedings, Azusa, California, 1970,” Vol. 2, pp. 221–231, 1970.Google Scholar
  12. 12.
    Landrock, A. H., “Adhesives Technology Handbook”Park Ridge, New Jersey, Noyes Publications, 1985.Google Scholar
  13. 13.
    Rosty, R., Martinelli, D., Devine, A., Bodnar, M J., and Beetle, J. SAMPE J., (July/August), 34 (1987).Google Scholar
  14. 14.
    Tira J, S SAMPE J., (July/August), 18 (1987).Google Scholar
  15. 15.
    Pocius, A. V., and Wenz, R. P., “30th National SAMPE Symposium, March 19–21, 1985” p. 1073.Google Scholar
  16. 16.
    Matienzo, L. J., Venebles, J. D., Fudge, J. D., and Velten, J. J., “30th National SAMPE Symposium, March 19–21, 1985, p. 302.Google Scholar
  17. 17.
    Crane, L. W., Hamermesh C.H, and Maus L., SAMPE J., (March/April), 6, (1976).Google Scholar
  18. 18.
    Wu, Szu-Iy, Schüler, A. M., and Keene, D. V., “SAMPE 19th International Technical Conference, Oct. 13–15, 1987”,” p. 277.Google Scholar

Copyright information

© Van Nostrand Reinhold, New York, NY 1990

Authors and Affiliations

  • C. Lynn Mahoney
    • 1
  1. 1.Dexter Adhesives and Structural Materials DivisionThe Dexter CorporationPittsburgUSA

Personalised recommendations