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Micrometallization Technologies

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Book cover Reduced Thermal Processing for ULSI

Part of the book series: NATO ASI Series ((NSSB,volume 207))

Abstract

As the semiconductor technology advances towards Ultra Large Scale Integration (ULSI), with device feature in the micron or submicron range, new metallization materials and processes are needed. Specifically, some of the requirements of the materials for ULSI metallization are low resistivity, low contact resistance, fine-line patternability, resistance to electromigration, strong adherence and good step coverage and conformality. Sometimes all of these requirements cannot be optimized simultaneously and one is forced to adopt a compromise.

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References

  1. D.W. Skelly, T.M. Lu and D.W. Woodruff in “VLSI Electronics Microstructure Science. Vol. 15. VLSI Metallization”. Editors N.G. Einspruch, S.S. Cohen and G. Sh. Gildenblat. Academic Press Inc., Orlando, (1987).

    Google Scholar 

  2. Y. Pauleau, Thin Solid Films, 122, 243 (1984)

    Article  ADS  Google Scholar 

  3. E.K. Broadbent and C.L. Ramiller, J. Electrochem. Soc, 131, 1427 (1984).

    Article  Google Scholar 

  4. E.K. Broadbent and W.T. Stacy, Solid State Technol., 28(12), 51 (1985).

    Google Scholar 

  5. Y. Pauleau, Solid State Technol., 30(4), 155 (1987).

    Google Scholar 

  6. R.S. Blewer, Solid State Technol., 29(11) f 117 (1986).

    ADS  Google Scholar 

  7. P.B. Ghate, J.C. Blair and R.C. Fuller, Thin Solid Films, 45, 69 (1977).

    Article  ADS  Google Scholar 

  8. P.S. Ho in “VLSI Science and Technology/1985”, Editors W.M. Bullis and S. Broido, The Electrochemical Society, Pennington (1985).

    Google Scholar 

  9. H. Kotani, T. Tsutsumi, J. Komori and S. Nagao, Int. Electron Devices Meeting p. 217 (1987).

    Google Scholar 

  10. S.S. Cohen and G.Sh. Gildenblat, “VLSI Electronics Microstructure Science. Vol. 13. Metal-Semiconductor Contacts and Devices”. Academic Press Inc., Orlando (1986).

    Google Scholar 

  11. T.J. Faith, R.S. Irven, S.K. Plaute and J.J. O’Neill, J. Vac. Sci. Technol., A1, 443 (1983).

    ADS  Google Scholar 

  12. R.A. Levy, M.L. Green and P.J. Gallagher, J. Electrochem. Soc, 131, 2175 (1984).

    Article  Google Scholar 

  13. P.B. Ghate in “Thin Films and Interfaces”, Editors P.S. Ho and K.N. Tu, New York, North Holland, (1982).

    Google Scholar 

  14. K.N. Tu, Appl. Phys. Lett., 27, 221 (1975).

    Google Scholar 

  15. C. Canali, C. Catellani, M. Prudenziati, W.H. Wadlin and C.A. Evans, Appl. Phys. Lett., 31, 43 (1977).

    Article  ADS  Google Scholar 

  16. C.A. Crider and J.M. Poate, Appl. Phys. Lett, 36, 417 (1980).

    Article  ADS  Google Scholar 

  17. A. Climent and S.J. Fonash, J. Appl. Phys., 56, 1063 (1984).

    Article  ADS  Google Scholar 

  18. M.A. Nicolet and S.S. Lau, in “VLSI Electronics Microsturcture Science”. Vol. 6. Editors N.G. Einspruch and G.B. Larrabee. Academic Press Inc., Orlando (1983).

    Google Scholar 

  19. C.Y. Ting and M. Wittmer, J. Appl. Phys., 54, 937 (1983).

    Article  ADS  Google Scholar 

  20. C.Y. Ting, J. Vac. Sci. Technol., 20, 14 (1982).

    Google Scholar 

  21. M.E. Alperin, IEEE Trans. Electron Dev., ED-32, 141 (1985).

    Article  Google Scholar 

  22. C. Arena, S. Deleonibus, G. Guegan, P. Laporte, F. Martin and J.L. Pelloie, p.577, 17th European Solid State Dev. Res. Conf., Bologna (1987).

    Google Scholar 

  23. Y. Taur, B. Davari, D. Moy, J.Y.C. Sun and C.Y. Ting, IBM J. Res. Develop., 31, 627 (1987).

    Article  Google Scholar 

  24. F. Neppl, F. Fisher and V. Schawabe, Thin Solid Films, 120, 257 (1984).

    Article  ADS  Google Scholar 

  25. K. Hieber and F. Neppl, Thin Solid Films, 140, 131 (1986).

    Article  ADS  Google Scholar 

  26. M. Eizenberg in “VLSI Science and Technology/1984”, Eitors K.E. Bean and G.A. Rozgonyi, The Electrochemical Society, Pennington (1984).

    Google Scholar 

  27. K. N. Tu, W.N. Hammer and J.O. Olowalafe, J. Appl. Phys., 51, 1663 (1980).

    Article  ADS  Google Scholar 

  28. S. Swirhun, K.C. Saraswat and R.M. Swanson; IEEE Electron Dev. Lett., 5, 209 (1984).

    Article  Google Scholar 

  29. M.J. Kim, R.N. Singh, D.M. Brown and D.W. Skelly in “VLSI Science and Technology/1985”, Editors W.M. Bullis and S. Broydo, The Electrochemical Society, Pennington (1985).

    Google Scholar 

  30. A. Lindberg, M. Östling, H. Noström and V. Wennström, p. 191, 17th European Solid State Dev. Res. Conf., Bologna (1987).

    Google Scholar 

  31. T. Mochizuki, Y. Tsujimaru, M. Kashiwagi and Y. Nishi, IEEE Trans Electron Devices, ED-27, 1431 (1980).

    Article  ADS  Google Scholar 

  32. A.G. Sabnis in “VLSI Electronics Microstructure Science. Vol. 15, VLSI Metallization”, Editors N.G. Einspruch, S.S. Cohen and G.Sh Gildenblat, Academic Press Inc., Orlando (1987).

    Google Scholar 

  33. A.C. Adams in “VLSI Tehcnology”, Editor S.M. Sze, McGraw-Hill Book Co, New York (1983).

    Google Scholar 

  34. T.I. Kamins, M.M. Mandurah and K.C. Sraswat, J. Electrochem. Soc., 125, 927 (1978).

    Article  Google Scholar 

  35. S.P. Murarka, “Silicides for VLSI Applications”, Academic Press, New York (1983).

    Google Scholar 

  36. S.P. Murarka, J. Vac. Sci. Technol., 17, 775 (1980).

    ADS  Google Scholar 

  37. A.K. Sinha, J. Vac. Sci. Technol., 19, 778 (1981).

    ADS  Google Scholar 

  38. T.P. Chow and A.J. Steckl, IEEE Trans. Electron Devices, ED-30, 1480 (1983).

    Article  Google Scholar 

  39. J. Denis, M. Fernández, J.P. González, J.M. Albella and J.M. Martínez-Duart, Thin Solid Films, 125, 243 (1985).

    Article  Google Scholar 

  40. P.T. Schraibhand, European Patent Application 212.266.

    Google Scholar 

  41. K.L. Wang, T.C. Holloway, R.F. Pinizotto, Z.P. Sobczak, W.R. Hunter and A.T. Tasch, IEEE Trans. Electron Devices, ED-29, 547 (1982).

    Article  ADS  Google Scholar 

  42. T.P. Chow, D.M. Brown, A.J. Steckl and M. Garfinkel, J. Appl. Phys., 51, 5981 (1980).

    Article  ADS  Google Scholar 

  43. T.P. Chow and A.J. Steckl, J. Appl. Phys., 53, 5531 (1982).

    Article  ADS  Google Scholar 

  44. A.G.M. Jonkers, Le Vide les Couches Minces, 42, 103 (1987).

    ADS  Google Scholar 

  45. M. Bartur and M-A. Nicolet, J. Electrochem. Soc., 131 371 (1984).

    Article  Google Scholar 

  46. J.M. Martínez-Duart, M. Fernández, E. Paule, A. Climent, J.M. Albella, J. Perrière and J. Siejka, Appl. Phys. Lett., 47, 579 (1985).

    Article  ADS  Google Scholar 

  47. J. Perrière, J. Siejka, A. Climent, E. Navarro and J.M. Martínez-Duart, J. Appl. Phys., 61, 2656 (1987)

    Article  ADS  Google Scholar 

  48. J. Crawford, Semiconductor International, p. 84, March, 1987.

    Google Scholar 

  49. Y. Pauleau, Solid State Technol., 30, (2), 61 (1987).

    Google Scholar 

  50. N. Yamamoto, S. Iwata, N. Kobayashi, K. Yagi and Wada in “VLSI Science and Technology/1984), Editors K.E. Bean and G.A. Rozgonyi, The Electrochemical Society, Pennington (1984).

    Google Scholar 

  51. M-A. Nicolet, Thin Solid Films, 52, 415 (1978).

    Article  ADS  Google Scholar 

  52. R.W. Bower, Appl. Phys. Lett., 23, 99 (1973).

    Article  ADS  Google Scholar 

  53. C.Y. Ting and M. Wittmer, Thin Solid Films, 9, 327 (1982).

    Article  Google Scholar 

  54. M-A. Nicolet and M. Batur, J. Vac. Sci. Technol., 19, 786 (1981).

    Article  ADS  Google Scholar 

  55. I.R. Shappirio, Solid State Technol., 28, 161 (1985).

    Google Scholar 

  56. M. Wittmer, J. Vac. Sci. Technol., A3, 1797 (1985).

    ADS  Google Scholar 

  57. J. Stimmel, J. Vac. Sci. Technol., B4, 1377 (1986).

    Google Scholar 

  58. R.S. Nowicki and M-A. Nicolet, Thin Solid Films, 96, 317 (1982).

    Article  ADS  Google Scholar 

  59. M. Wittmer, B. Studer and H. Melchior, J. Appl. Phys., 52, 5722 (1981).

    Article  ADS  Google Scholar 

  60. P.B. Ghate, Physics Today, Oct. 1986, p. 58.

    Google Scholar 

  61. J.A. Schwarz in “VLSI Electronics Microstructure Science”. Editors N.G. Einspruch, S.S. Cohen and G. Sh. Gildenblat. Academic Press Inc., Orlando (1987).

    Google Scholar 

  62. M.H. Woods in “VLSI Science and Technology/1985”. Editors W.M. Bullis and S. Broydo, The Electrochemical Society, Pennington (1985).

    Google Scholar 

  63. Y. Pauleau, Solid State Technol., 30(6), 101 (1987).

    Google Scholar 

  64. S. Shima, T. Moriya and M. Kashiwagi, Ext. Abst. 15th Conf. Solid State Dev. and Materials, Tokio, p. 233 (1983).

    Google Scholar 

  65. I. Ames, F.M. d’Heurle and R.E. Horstmann, IBM J. Res. Dev., 14, 461 (1970).

    Article  Google Scholar 

  66. F.M. d’Heurle, N.G. Ainslie, A. Gaugulee and M.C. Shino, J. Vac. Sci. Technol., 9, 289 (1972).

    Article  Google Scholar 

  67. A.K. Sinha, Thin Solid Films, 90, 271 (1982).

    Article  ADS  Google Scholar 

  68. S. Vaidya, D.B. Fraser and A.K. Sinha, Proc. 18th Reliability Physics Symposium IEEE, p. 165, New York (1980)

    Book  Google Scholar 

  69. J.K. Howard, J.F. White and P.S. Ho, J. Appl. Phys., 49, 4083 (1978).

    Article  ADS  Google Scholar 

  70. J.K. Lloyd and P.M. Smith, J. Vac. Sci. Technol., 1, 2 (1983).

    Google Scholar 

  71. A. J. Learn, J. Appl. Phys., 3, 44 (1973).

    Google Scholar 

  72. A.C. Adams and C.A. Capio, J. Electrochem. Soc, 126, 1042 (1979).

    Article  Google Scholar 

  73. D.S. Williams and E.A. Dein, J. Electrochem. Soc, 134, 657 (1987).

    Article  Google Scholar 

  74. A.M. Wilson, Thin SOlid Films, 83, 145 (1981).

    Article  ADS  Google Scholar 

  75. A.C. Adams, SOlid State Technol., 24, 178 (1981).

    Google Scholar 

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Author information

Authors and Affiliations

  1. Dept. Física Aplicada (UAM) and Inst, Ciencia de Materiales (CSIC), Universidad Autónoma, C-12. Cantoblanco, 28049, Madrid, Spain

    J. M. Martínez-Duart & J. M. Albella

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  1. J. M. Martínez-Duart
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  2. J. M. Albella
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Editor information

Editors and Affiliations

  1. AT&T Bell Laboratories, Murray Hill, New Jersey, USA

    Roland A. Levy

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© 1989 Plenum Press, New York

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Martínez-Duart, J.M., Albella, J.M. (1989). Micrometallization Technologies. In: Levy, R.A. (eds) Reduced Thermal Processing for ULSI. NATO ASI Series, vol 207. Springer, Boston, MA. https://doi.org/10.1007/978-1-4613-0541-5_8

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  • DOI: https://doi.org/10.1007/978-1-4613-0541-5_8

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4612-7857-3

  • Online ISBN: 978-1-4613-0541-5

  • eBook Packages: Springer Book Archive

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