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Multiphysics Simulation pp 189–197Cite as

Extensions to New Topics

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Part of the book series: Simulation Foundations, Methods and Applications ((SFMA))

Abstract

The field of multiphysics simulation is rapidly evolving due to continual increases in computing power and the multidisciplinary nature of engineering today. In this final chapter of the book, we collect our thoughts on how the numerical examples provided in this text may be extended to emerging ideas (or topics that have received limited attention) and that make use of state-of-the-art computational tools and optimization algorithms. While many of the case studies provided throughout this book incorporated two physical processes, only one example in Chap. 5 was focused on the simultaneous optimization of a system subject to three distinctly separate, yet coupled, physical phenomena. Here, we set forth a greater number of ideas related to these complex systems and leave it to the reader to explore them on their own. The relevance of such extensions is that most electromechanical applications require the tight integration and handling of more than two physical processes in three dimensions, are highly constrained, and involve specific interface considerations. Thus, topics including the scaling-up of systems, treatment of surfaces and interfaces, and the constraint of systems for manufacturability are covered.

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Author information

Authors and Affiliations

  1. Toyota Research Institute of North America, Ann Arbor, MI, USA

    Ercan M. Dede

  2. Korea Aerospace University, Goyang-si, Kyonggi-do, Korea, Republic of (South Korea)

    Jaewook Lee

  3. Toyota Central R&D Labs., Nagakute, Aichi, Japan

    Tsuyoshi Nomura

Authors
  1. Ercan M. Dede
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  2. Jaewook Lee
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  3. Tsuyoshi Nomura
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Correspondence to Ercan M. Dede .

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© 2014 Springer-Verlag London

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Dede, E.M., Lee, J., Nomura, T. (2014). Extensions to New Topics. In: Multiphysics Simulation. Simulation Foundations, Methods and Applications. Springer, London. https://doi.org/10.1007/978-1-4471-5640-6_6

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  • DOI: https://doi.org/10.1007/978-1-4471-5640-6_6

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  • Publisher Name: Springer, London

  • Print ISBN: 978-1-4471-5639-0

  • Online ISBN: 978-1-4471-5640-6

  • eBook Packages: Computer ScienceComputer Science (R0)

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