Abstract
Composite materials are traditionally designed for use as structural materials. With the rapid growth of the electronics industry, composite materials are finding more and more electronic applications. Owing to the vast difference in property requirements between structural composites and electronic composites, the design criteria for these two groups of composites are different. While structural composites emphasize high strength and high modulus, electronic composites emphasize high thermal conductivity, low thermal expansion, low dielectric constant, high/low electrical conductivity and/or electromagnetic interference (EMI) shielding effectiveness, depending on the particular electronic application. Low density is desirable for both aerospace structures and aerospace electronics. Structural composites emphasize processability into large parts, such as panels, whereas electronic composites emphasize processability into small parts, such as stand-alone films and coatings. Owing to the small size of the parts, material costs tend to be less of a concern for electronic composites than structural composites. For example, electronic composites can use expensive fillers, such as silver particles, which serve to provide high electrical conductivity.
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References
V. Sarihan and T. Fang, Structural Analysis in Microelectronic and Fiber Optic Systems, American Society of Mechanical Engineers, EEP, Vol. 12, ASME, New York, 1995, pp. 1–4.
W.E. Marsh, K. Kanakarajan and G.D. Osborn, Polymer/Inorganic Interfaces, Materials Research Soc. Symp. Proc., Materials Research Soc., Pittsburgh, PA, Vol. 304, 1993, pp. 91–96.
L.T. Nguyen and I.C. Noyan, Polymer Eng. Sci., 1988, 28 (16), 1013–1025.
W.-J. Yang and K. Kudo, Proc. Int. Symp. Heat Transfer Science and Technology, Beijing, China, Hemisphere Publ. Corp., Washington, DC, 1988, pp. 14–30.
A. Perkins and A. Guthrie, Metallurgia, 1982, 19 (12), 605–621.
K. Ebeling, Betonwerk und Fertigteil–Technik, 1994, 60 (12), 70–76.
F. Lazzari and G. Raffellini, Int. J. Ambient Energy, 1981, 2 (3), 141–149.
A. Kumar, U. Singh, A. Srivastava and G.N. Tiwari, Appl. Energy, 1981, 8 (4), 255–267.
S.P. Seth, M.S. Sodha and A.K. Seth, Appl. Energy, 1982, 10 (2), 141–149.
N.D. Kaushik and S.K. Rao, Appl. Energy, 1982, 12 (1), 21–36.
A.H. Fanney, B.P. Dougherty and K.P. Dramp, Proc. 1997 Int. Solar Energy Conf., ASME, New York, 1997, pp. 171–182.
B.H. Ramadan,ASHRAE Transactions, 1994, 100 (1), 160–167.
B.G. Fomin, Gidrotekhnicheskoe Stroitel’Stvo, 1999, (5), 12–14.
M. Sanchez-Romero and P. Alavedra-Ribot, Building Res. d Information, 1996, 24 (6), 369–373.
K. Pelissier, T. Chartier and J.M. Laurent, Ceramics Int., 1998, 24 (5), 371–377.
F.S.G. dos Santos and J.W. Swart, J. Electrochemical Soc., 1990, 137 (4), 1252–1255.
M.J. Cattelino, G.V. Miran and B. Smith, IEEE Transactions on Electron Devices, 1991, 38 (10), 2239–2243.
R. Chugh and D.D.L. Chung, Carbon, 2002, 40 (13), 2285–2289.
O.A. Portnoi, E.S. Shub, G.A. Il’ina, I.M. Stark, V.P. Zosin, S.T. Slavinskii, V.A. Bushtyrkov, V.A. Klyukvin and R.M. Levit, Fibre Chemistry (English translation of Khimicheskie Volokna) 1990, 21 (5), 420–422.
T. Kim and D.D.L. Chung, Carbon,in press.
C.-C. Hung, M.E. Dillehay and M. Stahl, J. Aircraft, 1987, 24 (10), 725–730.
J. Xie, J. Wang, X. Wang and H. Wang, Hecheng Shuzhi Ji Suliao/Synthetic Resin Plastics, 1996, 13 (1), 50–54.
C. Sandberg, W. Whitney, A. Nassar and G. Kuse, Proc. 1995 IEEE Int. conf. Systems, Man and Cybernetics, IEEE, Piscataway, NJ, 1995, 4, 3346–3351.
V.N. Prokushin, A.A. Shubin, V.V. Klejmenov and E.N. Marmer, Khimicheskie Volkna,1992, (2), 50–51.
H.W. Long and G.E. Long, US Patent 6, 193–793 (2001).
I.V. Avtonomov and G.A. Pugachev, Izvestiya Sibirskogo Otdeleniya Akademii Nauk Sssr, Seriya Tekhnicheskikh Nauk, 1987, 21, 110–114.
S. Yehia, C.Y. Tuan, D. Ferdon and B. Chen, ACI Mater. J., 2000, 97 (2), 172–181.
Y. Kasai, Concr. Int.: Design Construction, 1989, 11 (3), 33–38.
W. Nakagawa, K. Nishita and Y. Kasai, Proc. 2nd ASME-JSME Nuclear Eng. Joint Conf, ASME, New York, 1993, pp. 871–876.
F.S. Chute, F.E. Vermeulen and M.R. Cervenan, Canadian Electrical Eng. J., 1981, 6 (1), 20–28.
S. Wen and D.D.L. Chung, Cern. Concr. Res., 1999, 29 (6), 961–965.
S. Wen and D.D.L. Chung, Cern. Concr. Res., 1999, 29 (12), 1989–1993.
P. Chen and D.D.L. Chung, J. Electron Mater., 1995, 24 (1), 47–51.
Z. Shui, J. Li, E Huang and D. Yang, J. Wuhan Univ. Tech., 1995, 10 (4), 37–41.
P.-W. Chen, X. Fu and D.D.L. Chung, ACI Mater. J., 1997, 94 (2), 147–155.
P.-W. Chen and D.D.L. Chung, ACI Mater. J., 1996, 93 (2), 129–133.
P.L. Zaleski, D.J. Derwin and W.H. Flood Jr, US Patent 5, 707–171 (1998).
P. Xie, P. Gu, Y. Fu and J.J. Beaudoin, US Patent 5, 447–564 (1995).
H. Korner, A. Shiota and C.K. Ober, ANTEC ‘86: Plastics–Racing into the Future, Conf. Proc., Society of Plastics Engineers, Technical Papers Series, no. 42, Brookfield, Conn., Vol. 2, 1996, pp. 1458–1461.
G.S. Swei and D.J. Arthur, 3rd Int. SAMPE Symp. Exhib., SAMPE, Covina, CA, 1989, pp. 1111–1124.
L. Li and D.D.L. Chung, Composites, 1991, 22 (3), 211–218.
X. Lu and G. Xu, J. Appl. Polymer Sci., 1997, 65 (13), 2733–2738.
D. Klosterman and L. Li, J. Electronics Manufacturing, 1995, 5 (4), 277–287.
S.K. Kang, R. Rai and S. Purushothaman, 1996 Proc. 46th Electronic Components Technology, IEEE, New York, 1996, pp. 565–570.
G.F.C.M. Lijten, H.M. van Noort and P.J.M. Beris, J. Electronics Manufacturing, 1995, 5 (4), 253–261.
M.P. Zussman, B. Kirayoglu, S. Sharkey and D.J. Powell, 6th Int. SAMPE Electronics Conf, 1992, pp. 437–448.
J.D. Bolt and R.H. French, Adv. Mater. Processes, 1988, 134 (1), 32–35.
J.D. Bolt, D.P. Button and B.A. Yost, Mater. Sci. Eng., 1989, A109, 207–211.
S.P. Mukerherjee, D. Suryanarayana and D.H. Strope, J. Non-Crystalline Solids, 1992, 147, 148, 783–791.
M.P. Zussman, B. Kirayoglu, S. Sharkey and D.J. Powell, 6th Int. SAMPE Electronics Conf, 1992, pp. 437–448.
J.J. Glatz, R. Morgan and D. Neiswinger, Int. SAMPE Electronics Conf., Vol. 6, 1992, pp. 131–145.
A. Bertram, K. Beasley and W. de la Torre, Naval Engineers J., 1992, 104 (3), 276–285.
D. Brookstein and D. Maass, 7th Int. SAMPE Electronics Conf, 1994, pp. 310–327.
T.F. Fleming and W.C. Riley, Proc. SPIE–Int. Soc. for Optical Eng., Soc. Photo-Optical Instrumentation Engineers, Bellingham, WA, 1993, Vol. 1997, pp. 136–147.
T.F. Fleming, C.D. Levan and W.C. Riley, Proc. Technical Conf, Int. Electronics Packaging Conf., Wheaton, IL, Int. Electronics Packaging Society, 1995, pp. 493–503.
A.M. Ibrahim, 6th Int. SAMPE Electronics Conf, 1992, pp. 556–567.
N. Kiuchi, K. Ozawa, T. Komami, O. Katoh, Y. Arai, T. Watanabe and S. Iwai, Int. SAMPE Tech. Conf., Vol. 30, 1998, SAMPE, Covina, CA, pp. 68–77.
J.W.M. Spicer, D.W. Wilson, R. Osiander, J. Thomas and B.O. ONI, Proc. SPIE–International Society for Optical Engineering, Vol. 3700, 1999, pp. 40–47.
D.A. Foster, SAMPE Q. 1989, 21 (1), 58–64.
D.A. Foster, 34th Int. SAMPE Symp. Exhib., Book 2 (of 2), SAMPE, Covina, CA, 1989, pp. 1401–1410.
W. de la Torre, 6th Int. SAMPE Electronics Conf,1992, pp. 720–733.
P.D. Wienhold, D.S. Mehoke, J.C. Roberts, G.R. Seylar and D.L. Kirkbride, Int. SAMPE Tech. Goof, Vol. 30, SAMPE, Covina, CA, 1998, pp. 243–255.
X. Luo and D.D.L. Chung, Composites: Part B, 1999, 30 (3), 227–231.
L.G. Morin Jr and R.E. Duvall, Proc. Int. SAMPE Symp. Exhib., Vol. 43, No. 1, SAMPE, Covina, CA, 1998, pp. 874–881.
G. Lu, X. Li and H. Jiang, Composites Sci. Tech., 1996, 56, 193–200.
P.L. Smaldone, 27th Int. SAMPE Technical Conf., 1995, pp. 819–829.
J.J. Glatz, D.L. Vrable, T. Schmedake and C. Johnson, 6th Int. SAMPE Electronics Conf, 1992, p. 334–346.
R. Crossman, Northcon/85 - Conf. Rec., distributed by Western Periodicals Co., North Hollywood, CA, published by Electronic Conventions Management Inc., Los Angeles, CA, 1985, 21 pp.
D.S. McLachlan, M. Blaszkiewicz and R.E. Newnham, J. Am. Ceram. Soc., 1990, 73 (8), 2187–2203.
L. Li and D.D.L. Chung, Polymer Composites, 1993, 14 (6), 467–472.
L. Li, P. Yih and D.D.L. Chung, J. Electron. Mater., 1992, 21 (11), 1065–1071.
B. Guerrero, C. Alemân and R. Garza, J. Polymer Eng.,1997–1998, 17(2), 95–110.
M. Omastovâ, J. Pavlinec, J. Pionteck and F. Simon, Polymer Int., 1997, 43 (2), 109–116.
X.B. Chen and J.-P. Issi, M. Cassart, J. Devaux and D. Billaud, Polymer, 1994, 35 (24), 5256–5258.
P. Chen and D.D.L. Chung, J. Electron. Mater., 1995, 24 (1), 47–51.
J. Fournier, G. Boiteux, G. Seytre and G. Marichy, J. Mater. Sci. Lett., 1997, 16 (20), 1677–1679.
D. Klosterman and L. Li, J. Electronics Manufacturing, 1995, 5 (4), 277–287.
S.K. Kang, R. Rai and S. Purushothaman, 1996 Proc. 46th Electronic Components Technology, IEEE, New York, 1996, pp. 565–570.
W.R. Lambert and W.H. Knausenberger, Proceedings of the Technical Program–National Electronic Packaging and Production Conference, 1991, 3, 1512–1526.
J.A. Fulton, D.R. Horton, R.C. Moore, W.R. Lambert and J.J. Mottine, Proc. 39th Electronic Components Conf., IEEE, 1989, p., 71–77.
W.R. Lambert, J.P. Mitchell, J.A. Suchin and J.A. Fulton, Proc. 39th Electronic Components Conf., IEEE, 1989, pp. 99–106.
P.B. Hogerton, J.B. Hall, J.M. Pujol and R.S. Reylek, Mat. Res. Soc. Symp. Proc., 1989, 154, 415.
L. Li and D.D.L. Chung, J. Electronic Packaging, 1997, 119 (4), 255.
P.T. Robinson, V. Florescu, G. Rosen and M.T. Singer, Annual Connector er Interconnection Technology Symposium, International Institute of Connector and Interconnection Technology, Deerfield, IL, 1990, pp. 507–515.
G. Rosen, P.T. Robinson, V. Florescu and M.T. Singer, Proc. 6th IEEE Holm Conf. Electrical Contacts and 15th Int. Conf. Electric Contacts, IEEE, Piscataway, NJ, 1990, pp. 151–165.
D.D. Johnson, Proc. 3rd Int. Symp. Advanced Packaging Materials: Processes, Properties and Interfaces, IEEE, Piscataway, NJ and IMAPS, Reston, VA, 1997, pp. 29–30.
T. Kokogawa, H. Morishita, K. Adachi, H. Otsuki, H. Takasago and T. Yamazaki, Conference Record of 1991 International Display Conference, San Diego, IEEE, Piscataway, NJ and Society for Information Display, Playa Del Rey, CA, 1991, pp. 45–48.
N.P. Kreutter, B.K. Grove, P.B. Hogerton and C.R. Jensen, 7th Electronic Materials and Processing Congress, Cambridge, MA, Aug. 1992.
H. Yoshigahara, Y. Sagami, T. Yamazaki, A. Burkhart and M. Edwards, Proc. Technical Program: National Electronic Packaging and Production Conf, NEPCON West ‘81, Cahners Exposition Group, Des Plaines, IL, 1991, 1, 213–219.
D.M. Bruner, Int. J. Microcircuits and Electronic Packaging, 1995, 18 (3) 311.
J.J. Crea and P.B. Hogerton, Proc. Technical Program: National Electronic Packaging and Production Conf, NEPCON West ‘81, Cahners Exposition Group, Des Plaines, IL, Vol. 1, 1991, pp. 251–259.
K. Gilleo, Proc. Electricon ‘84, Electronics Manufacturing Productivity Facility,Indianapolis, IN, 1994, pp. 11/1–11/12.
K. Chung, G. Dreier, P. Fitzgerald, A. Boyle, M. Lin and J. Sager, Proc. 41st Electronic Components Conf, May 1991, pp. 345.
J.C. Bolger and J.M. Czarnowski, 1995 Japan IEMT Symp. Proc. 1995 Int. Electronic Manufacturing Technology Symp., IEEE, New York, 1996, pp. 476–481.
Y. Xu and D.D.L. Chung, J. Electron. Mater., 1999, 28 (11), 1307.
G.Y. Chin, Adv. Mater. Proc., 1990, 137(1), 47, 50, 86.
S. Liang, S.R. Chong and E.P. Giannelis, Proc. Electronic Components Technology Conf, IEEE, New York, Vol. 48, 1998, pp. 171–175.
V. Agarwal, P. Chahal, R.R. Tummala and M.G. Allen, Proc. Electronic Components and Technology Conf., IEEE, New York, Vol. 48, 1998, pp. 165–170.
J.Y. Park and M.G. Allen, Conf Proc.–IEEE Applied Power Electronics Conf. and Exposition–APEC, Vol. 1, 1997, pp. 361–367.
J.Y. Park, L.K. Lagorce and M.G. Allen, IEEE Trans. Magnetics,1997, 33(5), pt. 1, 3322–3324.
R. Charbonneau, Proc. Int. SAMPE Symp. Exhib.,Vol. 43, No. 1, SAMPE, Covina, CA, 1998, PP-833–844.
J. Wang, V.V. Varadan and V.K. Varadan, SAMPE J., 1996, 32 (6), 18–22.
S. Maugdal and S. Sankaran, Recent Trends in Carbon, Proc. National Conf., ed. O.P. Bahl, Shipra Publ., Delhi, India, 1997, pp. 12–19.
J.T. Hoback and J.T. Reilly, J. Elastomers Plastics, 1988, 20 (1), 54–69.
G. Lu, X. Li and H. Jiang, Composites Sci. Tech., 1996, 56, 193–200.
D.W. Radford, J. Adv. Mater., Oct. 1994, pp. 45–53.
C. Huang and J. Pai, J. Appl. Polymer Sci., 1997, 63 (1), 115–123.
D.W. Radford and B.C. Cheng, J. Testing Evaluation, 1993, 21 (5), 396–401.
S.R. Gerteisen, Northcon/85 - Conf. Rec., distributed by Western Periodicals Co., North Hollywood, CA, Paper 6.1, published by Electronic Conventions Management Inc., Los Angeles, CA, 1985, 9 pp.
P. O’Shea, Evaluation Engineering, 1995, 34 (8), 84–93.
P. O’Shea, Evaluation Engineering, 1996, 35 (8), 56–61.
R.A. Rothenberg and D.C. Inman, 1994 Int. Symp. Electromagnetic Compatibility, Technical Group on EMC of the Institute of Electronics, Information and Communication Engineers, and Technical Group on EMC of the Institute of Electrical Engineers of Japan, 1994, 818 pp.
J.W.M. Child, Electronic Production, Oct. 1986, pp. 41–47.
A.K. Subramanian, D.C. Pande and K. Boaz, Proc. 1995 Int. Conf. Electromagnetic Interference and Compatibility, Soc. EMC Engineers, Madras, India, 1995, pp. 139–147.
W. Hoge, Evaluation Engineering, 1995, 34 (1), 84–86.
J.F. Walther, IEEE 1989 Int. Symp. Electromagnetic Compatibility: Symp. Record, IEEE, New York, 1989, pp. 40–45.
H.W. Denny and K.R. Shouse, IEEE 1990 Int. Symp. Electromagnetic Compatibility: Symp. Record, IEEE, New York, 1990, pp. 20–24.
R. Bates, S. Spence, J. Rowan and J. Hanrahan, 8th Int. Conf. Electromagnetic Compatibility, Electronics Division, Institution of Electrical Engineers, London, 1992, pp. 246–250.
J.A. Catrysse, 8th Int. Conf. Electromagnetic Compatibility, Electronics Division, Institution of Electrical Engineers, London, 1992, pp. 251–255.
A.N. Faught, IEEE Int. Symp. Electromagnetic Compatibility, IEEE, New York, 1982, pp. 38–44.
G. Kunkel, IEEE Int. Symp. Electromagnetic Compatibility, IEEE, New York, 1980, pp. 211–216.
K.P. Sau, T.K. Chaki, A. Chakraborty and D. Khastgir, Plastics Rubber Composites Processing Applications, 1997, 26 (7), 291–297.
X. Shui and D.D.L. Chung, J. Electron Mater., 1995, 24 (2), 107–113.
X. Shui and D.D.L. Chung, J. Electron. Mater., 1996, 25 (6), 930–934.
X. Shui and D.D.L. Chung, J. Electron. Mater., 1997, 26 (8), 928–934.
X. Shui and D.D.L. Chung, J. Electron. Packaging, 1997, 119 (4), 236–238.
H. Gieser and E. Worley, International Integrated Reliability Workshop Final Report 1998, IEEE, Piscataway, NJ, 1998, p. 94–96.
R.B. Rosner, Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2000, ESD Assoc., Rome, NY, 2000, p. 121–131.
K.B. Cheng, S. Ramakrishna and K.C. Lee, Polym. Compos., 2001, 22 (2), 185–196.
Data sheet, Controlled Resistivity Alumina for Static Charge Dissipation, WESGO Technical Ceramics, Belmont, CA.
A.V. Zemlyanukhin, V.D. Alekseev, T.V. Timofeeva and Y.V. Nikifirov, Steklo i Keramika, 1992, (6), 21.
T.M. Zhdanova, A.V. Zemlyanukhin and S.N. Neumeecheva, Glass er Ceramics, 1991, 48 (3–4), 168.
T.M. Zhdanova, A.V. Zemlyanukhin and S.N. Neumeecheva, Steklo i Keramika, 1991, (4), 24.
P.O’Shea, Evaluation Eng., 1997, 36 (2), 6.
M.M. Mateev and D.L. Totev, Dautschuk d- Gummi Kunststoffe, 1996, 49 (6), 427.
S.E. Artemenko, L.P. Nikulina, T.P. Ustinova, D.N. Akbarov, E.P. Krajnov and V.I. Dubkova, Khimicheskie Volokna, 1992, (4), 39.
J.E. Travis, Soc. Plastics Eng. 8th Annual Pacific Technical Conference and Technical Displays, Society of Plastics Engineers, Brookfield Center, CT, 1985, p. 98.
A.I. Medalia, Rubber Chem. er Tech., 1986, 59 (3), 432.
S. Wen and D.D.L. Chung, J. Electron. Mater., 2001, 30 (11), 1448.
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Chung, D.D.L. (2003). Composite materials for electrical applications. In: Composite Materials. Engineering Materials and Processes. Springer, London. https://doi.org/10.1007/978-1-4471-3732-0_4
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