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Numerical Analysis for a Parallelepiped with Three-Dimensional Heat Transfer and Cure Reaction

  • J.-W. Vergnaud
  • J. Bouzon

Abstract

The parallelepiped problem is frequently encountered in the cure of thermosets. An analytical solution exists only when no reaction occurs in the resin and the thermal parameters are constant, for particular initial and boundary conditions. The problem is thus treated in a general way by considering heat transfer by conduction through the resin and heat evolved from the cure reaction. In this general case, the thermal parameters are temperature-dependent.

Keywords

Heat Transfer Heat Flux Thermal Parameter Heat Balance Cure Reaction 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer-Verlag London Limited 1992

Authors and Affiliations

  • J.-W. Vergnaud
    • 1
  • J. Bouzon
    • 1
  1. 1.Laboratoire de Chimie des Matériaux et Chimie Industrielle, Faculté des Sciences et TechniquesUniversité de Saint-EtienneSaint-Etienne Cédex 2France

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