Abstract
In Chapters 4 and 5 we discussed the mechanics of failure for overstress and fatigue related failure mechanisms. It should be clear to the reader at this point that stress analyses, mechanical, thermo-mechanical or perhaps thermal, will be necessary to model these failure mechanisms, during a reliability assessment and in design. Hence, we have placed our discussion of stress analysis here. The reader may again refer to this chapter at the completion of Part II of the text.
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Fan, M.S. (2001). Applications of Finite Element Analysis and Whole Field Stress Measurement. In: Evans, J.W., Evans, J.Y. (eds) Product Integrity and Reliability in Design. Springer, London. https://doi.org/10.1007/978-1-4471-0253-3_6
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DOI: https://doi.org/10.1007/978-1-4471-0253-3_6
Publisher Name: Springer, London
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