Interaction between a dynamically growing crack with stiff and compliant inclusions using DIC and high-speed photography

  • Kailash Jajam
  • Hareesh Tippur
Conference paper
Part of the Conference Proceedings of the Society for Experimental Mechanics Series book series (CPSEMS)


In this work, cylindrical inclusions of two different elastic moduli – stiff and compliant relative to the matrix – are examined. The former is a borosilicate glass inclusion whereas the latter is a polyurethane inclusion in an epoxy matrix. The 2D digital image correlation (DIC) technique along with high-speed photography is used to study crack growth behavior as a function of inclusion-matrix interfacial strength and the inclusion location relative to the crack under stress wave loading conditions. An ultra high-speed rotating mirror-type CCD digital camera is used to record random speckle patterns in the crack-inclusion vicinity at rates ranging from 150,000 to 300,000 frames per second. Two sets of images, one set before loading and another set during the fracture events are recorded. The crack tip deformation histories from the time of impact until complete fracture are mapped and fracture parameters are extracted. Different crack propagation patterns in terms of crack speed, crack path and stress intensity factor histories are observed followed by a macroscopic examination of fractured surfaces.


Digital Image Correlation Stress Intensity Factor Crack Velocity Cylindrical Inclusion Glass Inclusion 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.


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Copyright information

© The Society for Experimental Mechanics, Inc. 2013

Authors and Affiliations

  1. 1.Department of Mechanical EngineeringAuburn UniversityAuburnUSA

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