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Conclusions

  • Keren BergmanEmail author
  • Luca P. Carloni
  • Aleksandr Biberman
  • Johnnie Chan
  • Gilbert Hendry
Chapter
Part of the Integrated Circuits and Systems book series (ICIR, volume 68)

Abstract

Among the technologies that are emerging in the age of end-of-scaling CMOS, silicon photonics is perhaps the most promising to enable a smooth transition toward a new generation of post-CMOS computing systems. During the past decade a series of major breakthroughs in silicon photonic devices have demonstrated that all the components that are necessary to build chip-scale photonic interconnect components (e.g. modulators, filters, switches, detectors) can be fabricated using common CMOS processes. This key property of silicon photonics could allow a gradual integration of optical communication into CMOS integrated circuits. The photonics role can be increasingly expanded until it becomes central for the systems built with those so-called More-than-Moore technologies. Critically, during this transition silicon photonics could enable continued scaling of performance for a variety of applications because the unique properties of a chip-scale photonic network are not limited to the cross-chip communication distances. Instead, on-chip, board-scale, and cluster-scale distances are all equivalent in terms of optical communication performance. This is a fundamental difference with electronic communications, which must adhere to stricter bandwidth-distance product limitations.

Keywords

Continue Scaling Chip Multiprocessor Photonic Component Silicon Photonic Gradual Integration 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

Copyright information

© Springer Science+Business Media New York 2014

Authors and Affiliations

  • Keren Bergman
    • 1
    Email author
  • Luca P. Carloni
    • 1
  • Aleksandr Biberman
    • 1
  • Johnnie Chan
    • 1
  • Gilbert Hendry
    • 1
  1. 1.Department of Electrical EngineeringColumbia UniversityNew YorkUSA

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