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Supramolecular Assemblies Consisting of Naphthalene-Containing Anionic Amphiphiles and one-Dimensional Halogen-Bridged Platinum Complexes

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Abstract

Molecular wires have been attracting much interest due to their indispensable roles in molecular-scale electronic devises, and conventional researches are largely focused on π -conjugated polymeric systems. They suffer from limitations on the type of elements that can be incorporated into the chains. In contrast to the π -conjugated wires, one-dimensional inorganic complexes are composed of a rich variety of metal ions. A family of halogen-bridged one-dimensional MII/MIV mixed valence complexes [M(en)2][M’X2(en)2]Y4 (M, M’ = Pt, Pd, Ni, X = Cl, Br, I, en: 1,2,-diaminoethane, Y: counterions such as ClO4) has been attracting much interest due to their unique physicochemical properties such as intense intervalence charge transfer (CT) absorption, semiconductivity, and large third-order nonlinear optical susceptibilities.2 They are not soluble in organic media and when dispersed in water, the one-dimensional structure is disrupted and dissociate into constituent molecular complexes. We have recently developed a new strategy to solubilize such one-dimensional structures in organic media, by the formation of polyioncomplexes consisting of anionic lipids and the mixed valent complexes.3-5 In this study, we have newly synthesized naphthalene containing sulfonate amphiphiles and solution characteristics of the supramolecular complexes are discussed.

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© 2003 Kluwer Academic/Plenum Publishers

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Kimizuka, N., Hatanaka, Y., Kunitake, T. (2003). Supramolecular Assemblies Consisting of Naphthalene-Containing Anionic Amphiphiles and one-Dimensional Halogen-Bridged Platinum Complexes. In: Geckeler, K.E. (eds) Advanced Macromolecular and Supramolecular Materials and Processes. Springer, Boston, MA. https://doi.org/10.1007/978-1-4419-8495-1_8

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  • DOI: https://doi.org/10.1007/978-1-4419-8495-1_8

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4613-4630-2

  • Online ISBN: 978-1-4419-8495-1

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