Abstract
We stated in Chapter 19 that heat conduction can be described as the transfer of thermal energy from the hot to the cold part of a piece of material. We shall discuss now the mechanisms which are involved in this transfer of thermal energy.
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© 2011 Springer Science+Business Media, LLC
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Hummel, R.E. (2011). Thermal Conduction. In: Electronic Properties of Materials. Springer, New York, NY. https://doi.org/10.1007/978-1-4419-8164-6_21
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DOI: https://doi.org/10.1007/978-1-4419-8164-6_21
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Publisher Name: Springer, New York, NY
Print ISBN: 978-1-4419-8163-9
Online ISBN: 978-1-4419-8164-6
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