Thermal Management Fundamentals and Design Guides in Electronic Packaging

Chapter
Part of the Springer Series in Advanced Microelectronics book series (MICROELECTR., volume 30)

Abstract

With increased performance requirements for smaller, more capable, and more efficient electronic systems, thermal challenges have become critical issues in electronic packaging design. Breakthroughs are needed in advanced cooling solutions and pragmatic design at chip, board, and system package levels. In response to these critical needs, advanced materials and process improvements in packaging and cooling technology are required to provide high thermal transfer efficiency, well-controlled thermal transient behavior, environmental compatibility, low weight, and acceptable material and fabrication cost. The lowest device temperature and expected reliability will be achieved when the lowest package thermal resistance is achieved. This chapter provides an outline of thermal challenges in advanced electronic packaging, heat transfer theory, and its application in thermal design, development of thermal management solutions, advanced thermal management materials selection and component design guideline, as well as environmental compatibility requirements in thermal management of electronic packaging.

Keywords

Vortex Convection Boron Epoxy Shrinkage 

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Copyright information

© Springer Science+Business Media, LLC 2011

Authors and Affiliations

  1. 1.Laird TechnologiesSchaumburgUSA

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