Remote Sensing of Car Tire Pressure

  • Thomas Herndl


State-of-the-art tire pressure monitoring systems (TPMS) are wirelesssensor nodes mounted on the rim. Attaching the node on the inner liner of a tireallows sensing of important additional technical parameters, which may be used forimproved tracking and engine control, feedback to the power train and car-to-carcommunication purposes. Thus a significant step in car control appears feasible.Those new features come at a price: the maximum weight of the sensor is limited to5 g including package, power supply, and antenna. Robustness is required againstextreme levels of acceleration of up to 3,000 g (g = 9.81m/s2). The node size islimited to about 1 cm3 to avoid high force gradients due to device deformation andfinally, a 10-year power supply lifetime must be achieved. In this chapter we presenta self-sufficient tire-mounted wireless sensor node.
  • • with a bulk acoustic wave (BAW)-based low-power FSK transceiver;

  • • pioneered for an energy scavenger-based low-volume and low-weight powersupply; and

  • • a 3D vertical chip stack for best compactness, lowest volume, and highest robustnessfor pressure, inertia, and temperature sensing.


TPMS Tire pressure monitoring system Energy harvesting Energyscavenging Wireless sensor network 3D system integration Sensor system 


Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.


  1. 1.
    Ludvigsen K. (2003) Porsche. Excellence Was Expected, vol. 3. Bentley Publishers, Cambridge, MA, p 1011Google Scholar
  2. 2.
    Otis B et al (June 2004) An ultra-low power MEMS-based two-channel transceiver for wireless sensor network. VLSI CircuitsGoogle Scholar
  3. 3.
    Kowalewski M (August–September 2004) Monitoring and managing tire pressure. IEEE Potentials 23(3):8–10CrossRefMathSciNetGoogle Scholar
  4. 4.
    DuboisMA (July 2–4, 2003) Thin film bulk acoustic wave resonators: a technology overview. In: 4th Workshop on MEMS for Millimeterwave Communications, MEMSWAVE 2003, Toulouse, FranceGoogle Scholar
  5. 5.
    Dielacher M, FlatscherM, PribylW(July 2009) A low noise amplifier with on-chip matching network and integrated bulk acoustic wave resonators for high image rejection. In: Research in Microelectronics and Electronics, 2009. PRIME 2009. Ph.D., Cork, Ireland, pp 172–175Google Scholar
  6. 6.
    Chabloz J et al (February 6–9, 2006) A low power 2.4 GHz CMOS receiver front-end using BAWresonators. In: Solid State Circuits Conference ISSCC 2006. Digest of Technical Papers. IEEE International, San Francisco, CA, pp 1244–1253Google Scholar
  7. 7.
    Flatscher M, Dielacher M, Herndl T, Lentsch T, Matischek R, Prainsack J, Pribyl W, Theuss H, Weber W (February 2009) A robust wireless sensor node for in-tire-pressure monitoring. In: Solid-State Circuits Conference – Digest of Technical Papers, 2009. ISSCC 2009, IEEE International, San Francisco, CA, US, pp 286–287,287aGoogle Scholar
  8. 8.
    Flatscher M, Dielacher M, Herndl T, Lentsch T, Matischek R, Prainsack J, Pribyl W, Theuss H, Weber W (January 2010) A bulk acoustic wave (baw) based transceiver for an in-tirepressure monitoring sensor node. Solid-State Circuits, IEEE J. 45:167–177Google Scholar
  9. 9.
    Ramm P, Klumpp A, Weber J, Taklo M (December 2009) 3D System-on-Chip Technologies for More than Moore systems; P. Ramm, A. Klumpp, J. Weber, M. Taklo; 4 Remote Sensing of Car Tire Pressure 159 Journal of Microsystem Technologies (Springer), p. 1–5; Published online: Dec 18, 2009 DOI 10.1007/s00542-009-0976-1, ISSN: 1432–1858 (Online)
  10. 10.
    Lietaer N et al (October 4–9, 2009) Meet. Abstr. – Electrochem. Soc./MA2009-02/216th ECS Meeting. In: 3D Interconnect Technologies for Advanced MEMS/NEMS Applications – An Invited Talk, Vienna, AustriaGoogle Scholar
  11. 11.
    Schjølberg-Henriksen K et al (2009) Miniaturised sensor node for tire pressure monitoring (e-CUBES). In: Advanced Microsystems for Automotive Applications – Smart Systems for Safety, Sustainability, and Comfort, Meyer G, Valldorf J, Gessner W (eds.). Springer, Berlin, pp 313–332Google Scholar
  12. 12.
    Halvorsen E, Westby ER, Husa S, Vogl A, Østbø NP, Leonov V, Sterken T, Kvisterøy T (June 21–25 2009) An electrostatic energy harvester with electret bias. In: The IEEE 15th International Conference on Solid-State Sensors, Actuators & Microsystems, Transducers, 2009, pp 1381–1384, Denver, COGoogle Scholar
  13. 13.
    Lietaer N, TakloM, Klumpp A,Weber J, Ramm P (November 2009) 3D integration technologies for miniaturized tire pressure monitor systems (TPMS). San Jose, CA, US. In: Proceedings of 42nd International Symposium on Microelectronics – IMAPS 2009Google Scholar

Copyright information

© Springer Science+Business Media, LLC 2011

Authors and Affiliations

  1. 1.Infineon Technologies Austria AGViennaAustria

Personalised recommendations