Abstract
This article underscores the importance of thin silicon for the development of new RFID security products. Quality requirements are presented that show how the utilisation of thin silicon enables new business opportunities. A presentation of some typical RFID applications, based on thin silicon, gives an impression of thin silicon integration into RFID security products.
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References
Leybovich I (2010) RFID market projected to grow in 2010. 11 Mar 2010, http://news.thomasnet.com/IMT/archives/2010/03/radio-frequency-identification-rfid-market-projected-to-grow-in-2010-beyond.html
Kasemset B, Zenz C, Eiper E, van Driel WD, Yang DG (2009) Reliability modeling of IC package in smart card applications. Business Line Identification/Operations BE Innovation. NXP Semiconductors Austria GmbH, 10 Mar 2009
SMARTRAC Recognizing the world (2009) SmarTrac Company Presentation. p 11, http://www.smartrac-group.com/en/download_2/20071030_SMARTRAC_Brochure.pdf
Feil M, Landesberger C, Bock K (2010) The challenge of ultra thin chip assembly. Fraunhofer Institute for Reliability and Microintegration (IZM), Hansastr. 27d, Germany. Downloaded 25 Apr 2010, www.izm.fraunhofer.de/Images/114_feil_tcm357-92246.pdf
Bundes Druckerei, www.bundesdruckerei.de
Tesa-Scribos, www.tesa-scribos.com
PolyIC, www.polyic.com
Presentation 7.5-micron-thick chip, IEEE International Solid-State Circuits Conference (ISSCC) in San Francisco. 5 Feb 2006
Acknowledgements
The information related to multifunctional smartcards presented in this article is partially based on publically funded innovation activities. The author would like to thank the BSI (Bundesministerium für Sicherheit in der Informationstechnologie) for funding the InSiTo project and the BMBF (Bundesministerium für Bildung und Forschung) for funding the SECUDIS project.
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Suwald, T. (2011). Thin Chips for Document Security. In: Burghartz, J. (eds) Ultra-thin Chip Technology and Applications. Springer, New York, NY. https://doi.org/10.1007/978-1-4419-7276-7_31
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DOI: https://doi.org/10.1007/978-1-4419-7276-7_31
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